H05K 2201/10984
Component carrying a connection agent
Official title: Component carrying a connection agent, e.g. solder, adhesive
H05K2201/10984 (Component carrying a connection agent) appears on 424 US grants and 298 published applications in this corpus.
Search patents in H05K- Granted patents
- 424
- Published applications
- 298
- Assignees
- 215
- Inventors
- 764
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 3 | 0 |
| 1979 | 4 | 0 |
| 1980 | 3 | 0 |
| 1981 | 2 | 0 |
| 1982 | 5 | 0 |
| 1983 | 2 | 0 |
| 1984 | 4 | 0 |
| 1985 | 7 | 0 |
| 1986 | 6 | 0 |
| 1987 | 11 | 0 |
| 1988 | 13 | 0 |
| 1989 | 9 | 0 |
| 1990 | 4 | 0 |
| 1991 | 5 | 0 |
| 1992 | 6 | 0 |
| 1993 | 9 | 0 |
| 1994 | 11 | 0 |
| 1995 | 11 | 0 |
| 1996 | 12 | 0 |
| 1997 | 10 | 0 |
| 1998 | 14 | 0 |
| 1999 | 9 | 0 |
| 2000 | 12 | 0 |
| 2001 | 10 | 4 |
| 2002 | 12 | 13 |
| 2003 | 8 | 10 |
| 2004 | 11 | 14 |
| 2005 | 11 | 20 |
| 2006 | 12 | 20 |
| 2007 | 11 | 15 |
| 2008 | 7 | 11 |
| 2009 | 11 | 10 |
| 2010 | 8 | 11 |
| 2011 | 9 | 17 |
| 2012 | 14 | 7 |
| 2013 | 2 | 11 |
| 2014 | 10 | 5 |
| 2015 | 12 | 12 |
| 2016 | 3 | 5 |
| 2017 | 6 | 6 |
| 2018 | 8 | 7 |
| 2019 | 10 | 5 |
| 2020 | 8 | 14 |
| 2021 | 6 | 8 |
| 2022 | 11 | 7 |
| 2023 | 6 | 18 |
| 2024 | 11 | 27 |
| 2025 | 17 | 8 |
| 2026 | 16 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electrical equipment22 Sep 2026US 12,745,351 B2Valeo Electrification
- Illuminated signage and badges15 Sep 2026US 12,739,970 B2CoreLED Systems, LLC
- Micro circuit structure and manufacturing method thereof1 Sep 2026US 12,727,077 B2Kinsus Interconnect Technology Corp.
- Display device1 Sep 2026US 12,727,083 B2Samsung Display Co., Ltd.
- Power module28 Jul 2026US 12,695,023 B2Delta Electronics, Inc.
- Semiconductor storage device8 Oct 2026US 2026/0313798 A1Kioxia Corporation
- Lead electro-etching before plating to mitigate burr1 Oct 2026US 2026/0304630 A1
- Adhesive agent composition, adhesive agent film for circuit connection, circuit connection structure, and method for manufacturing same24 Sep 2026US 2026/0293741 A1
- Electronic module13 Aug 2026US 2026/0239542 A1Delta Electronics, Inc.
- Pcb land pad for three-pin mosfet component30 Jul 2026US 2026/0223289 A1Micron Technology, Inc.
Most cited
By later US patents
- Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders244US 5,203,075 AInernational Business Machines Corporation · 1993
- Method of forming electrically conductive polymer interconnects on electrical substrates159US 5,611,140 AEpoxy Technology, Inc. · 1997
- Solder mounting of electrical contacts132US 4,767,344 ABurndy Corporation · 1988
- Direct chip attachment structure and method131US 5,439,162 AMotorola, Inc. · 1995
- Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate122US 5,159,535 AInternational Business Machines Corporation · 1992