Pcb land pad for three-pin mosfet component
AssigneeMicron Technology, Inc.
InventorShriram Harihara Subramanian
Life of this patent
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Abstract
A printed circuit board (PCB) land pad for a three-pin metal–oxide–semiconductor field-effect transistor (MOSFET) component comprises four pads with a split pad for a drain terminal of the MOSFET component. The PCB land pad comprises: a first pad to connect a gate terminal of the MOSFET component to a PCB; a second pad to connect a source terminal of the MOSFET component to the PCB; a third pad corresponding to connect a drain terminal of the MOSFET component to the PCB; and a fourth pad to connect the drain terminal of the MOSFET component to the PCB.
Claims20
A printed circuit board (PCB) land pad for a metal–oxide–semiconductor field-effect transistor (MOSFET) component comprising:
- a first pad to connect a gate terminal of the MOSFET component to a PCB;
- a second pad to connect a source terminal of the MOSFET component to the PCB;a third pad corresponding to connect a drain terminal of the MOSFET component to the PCB;
- and a fourth pad to connect the drain terminal of the MOSFET component to the PCB.
A method for producing an assembled printed circuit board (PCB), the method comprising:
- applying a solder mask to a copper layer of a PCB, the solder mask defining a land pad for a metal-oxide-semiconductor field-effect transistor (MOSFET) component, the land pad comprising a gate pad, a source pad, a first drain pad, and a second drain pad, the MOSFET component comprising a gate terminal, a source terminal, and a drain terminal;
- and soldering the drain terminal to the first drain pad and to the second drain pad.
A non-transitory machine-readable medium storing circuit design data that, when used to fabricate a printed circuit board (PCB), causes the PCB to include a land pad for a three-pin metal-oxide-semiconductor field-effect transistor (MOSFET) component, the land pad defined by the circuit design data as comprising:
- a first pad to connect a gate terminal of the MOSFET component to a PCB;
- a second pad to connect a source terminal of the MOSFET component to the PCB;
- a third pad corresponding to connect a drain terminal of the MOSFET component to the PCB;
- and a fourth pad to connect the drain terminal of the MOSFET component to the PCB.
Dependencies are inferred from the claim text.