Lead electro-etching before plating to mitigate burr

Abstract

An electronic device includes a package structure having a side in a plane of orthogonal first and second directions, a conductive lead, and a plating layer on a bottom side of the conductive lead and including a first portion exposed along the side of the package structure and a second portion extending inward along a third direction that is orthogonal to the first and second directions between a lateral side of the conductive lead and the package structure. A method of fabricating an electronic device includes performing an electric etch process to etch a surface of a conductive lead exposed along a side of a package structure, and performing a plating process that forms a plating layer on an etched surface of the conductive lead.

Dependencies are inferred from the claim text.