H05K 2201/10962
Component not directly connected to the pcb
Official title: Component not directly connected to the PCB
H05K2201/10962 (Component not directly connected to the pcb) appears on 272 US grants and 241 published applications in this corpus.
Search patents in H05K- Granted patents
- 272
- Published applications
- 241
- Assignees
- 207
- Inventors
- 623
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 3 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 3 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 5 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 4 | 0 |
| 1998 | 3 | 0 |
| 1999 | 5 | 0 |
| 2000 | 4 | 0 |
| 2001 | 3 | 0 |
| 2002 | 4 | 2 |
| 2003 | 2 | 3 |
| 2004 | 2 | 4 |
| 2005 | 4 | 1 |
| 2006 | 5 | 4 |
| 2007 | 1 | 9 |
| 2008 | 4 | 13 |
| 2009 | 8 | 13 |
| 2010 | 8 | 15 |
| 2011 | 13 | 11 |
| 2012 | 7 | 8 |
| 2013 | 8 | 13 |
| 2014 | 6 | 23 |
| 2015 | 22 | 17 |
| 2016 | 22 | 15 |
| 2017 | 13 | 15 |
| 2018 | 17 | 16 |
| 2019 | 17 | 9 |
| 2020 | 12 | 10 |
| 2021 | 5 | 9 |
| 2022 | 10 | 12 |
| 2023 | 8 | 6 |
| 2024 | 6 | 8 |
| 2025 | 6 | 3 |
| 2026 | 3 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Spring bracket and sensor device including same8 Sep 2026US 12,733,102 B2Johnson Controls Fire Protection LP
- Package device including capacitor disposed on opposite side of die relative to substrate23 Jun 2026US 12,667,023 B2Samsung Electronics Co., Ltd.
- M.2 WLAN module holder17 Feb 2026US 12,554,297 B2Dell Products L. P.
- Inlay with exposed porous layer, component carrier and manufacturing methods25 Nov 2025US 12,484,154 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Connection structure using elastic member and electronic device including the same21 Oct 2025US 12,451,584 B2Samsung Electronics Co., Ltd.
- Composite electronic component and board having composite electronic component mounted thereon2 Jul 2026US 2026/0188595 A1Samsung Electro-Mechanics Co., Ltd.
- Inlay With Exposed Porous Layer, Component Carrier, and Manufacturing Method19 Mar 2026US 2026/0082487 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- 3d printed bridges for printed interconnects4 Dec 2025US 2025/0372904 A1
- Mechanical component for electrical contact, and corresponding control module and motor-fan assembly27 Nov 2025US 2025/0365864 A1Valeo Systemes Thermiques
- M.2 wlan module holder10 Jul 2025US 2025/0224781 A1Dell Products L. P.
Most cited
By later US patents
- Coaxial interconnect devices and methods of making the same77US 5,791,911 AInternational Business Machines Corporation · 1998
- Method of making metal filled via holes in ceramic circuit boards57US 4,131,516 AInternational Business Machines Corporation · 1978
- Electrical connector adapter assembly57US 6,364,713 B1Hon Hai Precision Ind.Co., Ltd. · 2002
- Electrical apparatus containing batteries40US 5,796,588 ASanyo Electric Co., Ltd. · 1998
- Mounting arrangement for circuit breaker current sensing transformers36US 4,652,975 AGeneral Electric Company · 1987