Composite electronic component and board having composite electronic component mounted thereon

A composite electronic component comprising:

• a plurality of multilayer electronic components, each multilayer electronic component among the plurality of multilayer electronic components including:
• a body including:
• a capacitance formation portion including:
• a dielectric layer, and
• internal electrodes alternately disposed with the dielectric layer in a first direction, and
• a cover portion that includes a first cover portion and a second cover portion, the first cover portion is disposed on a first side surface of the capacitance formation portion in the first direction, and the second cover portion is disposed on a second side surface of the capacitance formation portion in the first direction, and
• an external electrode disposed on the body in a second direction that is perpendicular to the first direction,
• wherein the plurality of multilayer electronic components include a pair of multilayer electronic components disposed to be in contact with each other in the first direction,
• when, among the pair of multilayer electronic components, the first cover portions are disposed to be adjacent to each other in the first direction, and the second cover portions are disposed to not be adjacent to each other in the first direction, and
• an average dimension of the dielectric layer in the first direction is referred to as td, an average dimension of the first cover portion in the first direction is referred to as tc1, and an average dimension of the second cover portion in the first direction is referred to as tc2, 0.5×td≤tc1<tc2 is satisfied.