Package device including capacitor disposed on opposite side of die relative to substrate

A package device comprising:

• a motherboard;
• at least one antenna connected to the motherboard;
• a substrate comprising a bottom surface facing the motherboard and a top surface that is an opposite surface of the bottom surface;
• a plurality of upper lands disposed on the top surface of the substrate;
• a plurality of upper solder balls disposed on the plurality of upper lands;
• a die connected to the plurality of upper solder balls;
• a plurality of lower lands disposed on the bottom surface of the substrate;
• a plurality of lower solder balls disposed on some of the plurality of lower lands;
• a capacitor connected to the lower lands on which the plurality of lower solder balls are not disposed among the plurality of lower lands, provided on an opposite side of the die, and comprising a height greater than the height of the plurality of lower solder balls;
• an interposer disposed between the substrate and the motherboard and connected to the plurality of lower solder balls;
• and
• a plurality of interposer solder balls connecting the interposer to the motherboard,
• wherein the capacitor is disposed at a position overlapping the die based on a height direction of the substrate.

A package device comprising:

• a motherboard;
• at least one antenna connected to the motherboard;
• a substrate comprising a bottom surface facing the motherboard and a top surface that is an opposite surface of the bottom surface;
• a plurality of upper lands disposed on the top surface of the substrate;
• a plurality of upper solder balls disposed on the plurality of upper lands;
• a die connected to the plurality of upper solder balls;
• a plurality of lower lands disposed on the bottom surface of the substrate;
• a plurality of lower solder balls disposed on some of the plurality of lower lands;
• a capacitor connected to the lower lands on which the plurality of lower solder balls are not disposed among the plurality of lower lands, provided on an opposite side of the die, and comprising a height greater than the height of the plurality of lower solder balls;
• a plurality of board lands disposed on a surface of the motherboard facing the other surface of the substrate;
• and
• a connecting pin disposed between a lower solder ball disposed on one of the plurality of lower lands and a board land facing the one of the plurality of lower lands,
• wherein the capacitor is disposed at a position overlapping the die based on a height direction of the substrate.