Inlay with exposed porous layer, component carrier and manufacturing methods
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsStefanie Paller, Gernot Grober
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Abstract
An inlay for a component carrier includes a gas-permeable porous layer structure, an upper layer structure, arranged on the gas-permeable porous layer structure, the upper layer structure defining a cavity such that a portion of the gas-permeable porous layer structure is exposed and an upper metal layer structure arranged on the upper layer structure. A component carrier with the inlay and manufacturing methods of the inlay and the component carrier are described.
Claims19
An inlay for a component carrier, the inlay comprising:
- a gas-permeable porous layer structure;
- an upper layer structure, arranged on the gas-permeable porous layer structure,
- wherein the upper layer structure comprises a cavity, configured so that an upper part of the gas-permeable porous layer structure is exposed;
- and
- an upper metal layer structure, arranged on the upper layer structure;
- wherein the upper metal layer comprises a metal layer cavity configured such that a part of the gas permeable porous layer structure is exposed.
A component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure;
- and
- an inlay including:
- a gas-permeable porous layer structure;
- an upper layer structure, arranged on the gas-permeable porous layer structure,
- wherein the upper layer structure comprises a cavity, configured se such that an upper part of the gas-permeable porous layer structure is exposed;
- an upper metal layer structure, arranged on the upper layer structure;
- an upper stack cavity configured such that an upper part of the gas permeable porous layer structure is exposed;
- wherein the inlay is assembled to the stack.
A method of manufacturing an inlay for a component carrier, the method comprising:
- providing a gas-permeable porous layer structure;
- arranging a layer structure on the gas-permeable porous layer structure;
- forming a cavity in the layer structure, thereby exposing an upper part of the gas-permeable porous layer structure;
- arranging a metal layer structure on the layer structure;
- and
- forming a metal layer cavity in the metal layer such that a portion of the gas permeable porous layer structure is exposed.
A method of manufacturing a component carrier, the method comprising:
- forming a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure;
- and
- assembling an inlay to the stack, the inlay comprising:
- a gas-permeable porous layer structure;
- an upper layer structure, arranged on the gas-permeable porous layer structure,
- wherein the upper layer structure comprises a cavity, configured so that an upper part of the gas-permeable porous layer structure is exposed;
- an upper metal layer structure, arranged on the upper layer structure;
- and
- forming an upper stack cavity such that an upper part of the gas-permeable porous layer structure is exposed.
Dependencies are inferred from the claim text.