H05K 2201/10977
Encapsulated connections
H05K2201/10977 (Encapsulated connections) appears on 1,007 US grants and 1,032 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,007
- Published applications
- 1,032
- Assignees
- 408
- Inventors
- 2,292
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 8 | 0 |
| 1987 | 7 | 0 |
| 1988 | 5 | 0 |
| 1989 | 7 | 0 |
| 1990 | 4 | 0 |
| 1991 | 10 | 0 |
| 1992 | 10 | 0 |
| 1993 | 5 | 0 |
| 1994 | 17 | 0 |
| 1995 | 14 | 0 |
| 1996 | 11 | 0 |
| 1997 | 12 | 0 |
| 1998 | 20 | 0 |
| 1999 | 16 | 0 |
| 2000 | 19 | 0 |
| 2001 | 35 | 16 |
| 2002 | 31 | 44 |
| 2003 | 41 | 41 |
| 2004 | 30 | 49 |
| 2005 | 35 | 51 |
| 2006 | 30 | 61 |
| 2007 | 36 | 62 |
| 2008 | 30 | 69 |
| 2009 | 37 | 76 |
| 2010 | 49 | 64 |
| 2011 | 52 | 41 |
| 2012 | 49 | 38 |
| 2013 | 42 | 28 |
| 2014 | 30 | 39 |
| 2015 | 21 | 42 |
| 2016 | 35 | 36 |
| 2017 | 35 | 25 |
| 2018 | 38 | 32 |
| 2019 | 22 | 26 |
| 2020 | 25 | 22 |
| 2021 | 25 | 22 |
| 2022 | 10 | 29 |
| 2023 | 18 | 39 |
| 2024 | 25 | 36 |
| 2025 | 36 | 26 |
| 2026 | 11 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic structure and a method of manufacturing such11 Aug 2026US 12,707,567 B1Tacto Tek Oy
- Electrical contact arrangement for microfabricated ultrasonic transducer4 Aug 2026US 12,701,918 B2Bfly Operations, Inc.
- Multilayer coil component21 Jul 2026US 12,688,964 B2TDK Corporation
- Conductive module12 May 2026US 12,628,279 B2Yazaki Corporation
- Flexible circuit board, display panel and method for manufacturing same, and display device21 Apr 2026US 12,610,456 B2Boe Technology Group Co., Ltd.
- Circuit module, circuit board, electronic device, and package module10 Sep 2026US 2026/0271181 A1Lite-On Technology Corporation
- Manufacturing method for a mounting board and mounting board20 Aug 2026US 2026/0248020 A1Sony Semiconductor Solutions Corporation
- Mounting structure of multilayer electronic component23 Jul 2026US 2026/0214804 A1Samsung Electro-Mechanics Co., Ltd.
- Systems for power module packaging16 Jul 2026US 2026/0206141 A1Dana Tm4 Italia S.R.L.
- Immersion cooled integrated circuit package2 Jul 2026US 2026/0191001 A1Microsoft Technology Licensing, LLC
Most cited
By later US patents
- Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making339US 4,604,644 AInternational Business Machines Corporation · 1986
- Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices266US 6,326,698 B1Micron Technology, Inc. · 2001
- Flip chip technology using electrically conductive polymers and dielectrics219US 5,074,947 AEpoxy Technology, Inc. · 1991
- Low cost chip size package and method of fabricating the same204US 6,181,569 B22001
- Flip chip bonding method using electrically conductive polymer bumps194US 5,196,371 AEpoxy Technology, Inc. · 1993