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US 12,701,918 B2Granted
Electrical contact arrangement for microfabricated ultrasonic transducer
AssigneeBfly Operations, Inc.
InventorsJonathan M. Rothberg, Susan A. Alie, Jaime Scott Zahorian, Paul Francis Cristman, Keith G. Fife
Life of this patent
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Abstract
An ultrasound-on-a-chip device has an ultrasonic transducer substrate with plurality of transducer cells, and an electrical substrate. For each transducer cell, one or more conductive bond connections are disposed between the ultrasonic transducer substrate and the electrical substrate. Examples of electrical substrates include CMOS chips, integrated circuits including analog circuits, interposers and printed circuit boards.
Claims9
An apparatus, comprising:
- an ultrasound-on-a-chip device comprising an ultrasonic transducer substrate having a plurality of individual ultrasonic transducer cells disposed proximate a first side of the ultrasonic transducer substrate;
- and
- for each individual transducer cell, multiple conductive bond connections disposed between a second side of the ultrasonic transducer substrate and an integrated circuit substrate, wherein the first side of the ultrasonic transducer substrate faces away from the integrated circuit substrate while the second side of the ultrasonic transducer substrate faces toward the integrated circuit substrate;
- and
- a plurality of acoustically inactive regions of the ultrasonic transducer substrate each acoustically inactive region of the plurality of acoustically inactive regions including a single conductive bond connection connected to the integrated circuit substrate.
2 more elements
Dependencies are inferred from the claim text.