Immersion cooled integrated circuit package

A system, comprising:

• a printed circuit board;
• an integrated circuit;
• a ball grid array that electrically couples the integrated circuit to the printed circuit board, wherein the printed circuit board is configured to operate in a vertical orientation with a face of the printed circuit board on which the integrated circuit is electrically coupled with via the ball grid array being substantially perpendicular to ground;
• and
• an edge bond that is coupled to the integrated circuit along a perimeter edge of the integrated circuit and the printed circuit board and that creates a fluid barrier, wherein the edge bond, the integrated circuit and the printed circuit board define an aperture that exposes a portion of the perimeter edge of the integrated circuit and exposes the ball grid array to fluid flow, and wherein the aperture and the portion of the perimeter edge of the integrated circuit faces ground when the printed circuit board is in the vertical orientation.

A method of two-phase immersion cooling, comprising:

• operating at least one computing system that is at least partially submerged in immersion fluid housed in a two-phase immersion cooling container, wherein the at least one computing system comprises:
• a printed circuit board;
• an integrated circuit;
• a ball grid array that electrically and mechanically couples the integrated circuit to the printed circuit board;
• and
• a sealant between the printed circuit board and the integrated circuit that substantially prevents fluid flow of the immersion fluid across at least a portion of a plurality of solder balls that are included in the ball grid array when the integrated circuit is operating at a temperature that boils the immersion fluid;
• and
• condensing, with a condenser, immersion fluid that is in a vapor state from the operation of the at least one computing system to a liquid state.