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US 2026/0206141 A1Published application
Systems for power module packaging
AssigneeDana Tm4 Italia S.R.L.
InventorsPierpaolo ZULPO, Luca VIRZÌ
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Abstract
Systems and methods are provided for a power module. In one example, a system for a power module includes a substrate including a primary body and a perimeter, a plurality of bonds coupled to the perimeter, wherein the plurality of bonds is divided into segments, each segment including multiple loops and linear portions, and a molding compound covering a surface of the substrate and filling openings between loops of the plurality of bonds and the substrate.
Claims20
A system, comprising:
- a plurality of bonds coupled to a perimeter of a substrate;
- and
- a molding compound covering a surface of the substrate and filling openings between loops of the plurality of bonds and the substrate.
A system for a power module, comprising:
- a substrate comprising a primary body and a perimeter;
- a plurality of bonds coupled to the perimeter, wherein the plurality of bonds is divided into segments, each segment comprising a plurality of loops and a plurality of linear portions;
- and
- a molding compound covering a surface of the substrate and filling openings between loops of the plurality of bonds and the substrate.
1 more element
A system, comprising:
- a base coupled to a substrate;
- and
- a plurality of bonds coupled to a surface of the substrate opposite the base, wherein each of the plurality of bonds comprises at least one semi-circle positioned between two linear portions.
Dependencies are inferred from the claim text.