Mounting structure of multilayer electronic component
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsWon Chul SIM, Se Hun PARK, Soo Hwan SON, Young Ghyu AHN
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Abstract
A mounting structure of a multilayer electronic component according to an example embodiment of the present disclosure includes: a printed circuit board including an electrode pad; a multilayer electronic component disposed on the printed circuit board, the multilayer electronic component including a body and external electrodes disposed on the body; a coating layer disposed to cover at least a portion of the multilayer electronic component; and a molding layer disposed on the coating layer, and a Young's modulus of the coating layer is less than 500 MPa.
Claims16
A mounting structure of a multilayer electronic component, comprising:
- a printed circuit board including an electrode pad;
- a multilayer electronic component disposed on the printed circuit board, the multilayer electronic component including a body and external electrodes disposed on the body;
- a coating layer disposed to cover at least a portion of the multilayer electronic component;
- and
- a molding layer disposed on the coating layer,
- wherein a Young's modulus of the coating layer is less than 500 MPa.
Dependencies are inferred from the claim text.