Conductive module
AssigneeYazaki Corporation
InventorHidehiko Shimizu
Life of this patent
Estimating the term…
Abstract
A conductive module includes: a flexible printed wiring board; an electronic component that is mounted on the flexible printed wiring board and connected to a circuit pattern of the flexible printed wiring board; a first potting agent that covers a connection part between the electronic component and the flexible printed wiring board; and a second potting agent that overlaps the first potting agent from the opposite side of the flexible printed wiring board, and covers the first potting agent and the electronic component. The first potting agent has higher flexibility as compared with the second potting agent.
Claims8
A conductive module comprising:
- a flexible printed wiring board;
- an electronic component that is mounted on the flexible printed wiring board and connected to a circuit pattern of the flexible printed wiring board;
- a first potting agent that covers a connection part between the electronic component and the flexible printed wiring board;
- and
- a second potting agent that directly contacts and overlaps the first potting agent from the opposite side of the flexible printed wiring board, and covers the first potting agent and the electronic component, wherein
- the first potting agent has higher flexibility as compared with the second potting agent.
Dependencies are inferred from the claim text.