Flexible circuit board, display panel and method for manufacturing same, and display device
AssigneesChengdu Boe Optoelectronics Technology Co., Ltd., Boe Technology Group Co., Ltd.
InventorsYonglin Chen, Yunhan Xiao, Hongjin Hu, Jiaxiang Zhang, Kun Zuo, Mingqiang Wang, Jiuyuan Bai
Life of this patent
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Abstract
Provided is a flexible circuit board. The flexible circuit board includes a circuit substrate; wherein the circuit substrate is a multilayer flexible circuit board, wherein at least two layers of the multilayer flexible circuit board include plated sublayers, and a plurality of grooves are disposed in a first surface of the multilayer flexible circuit board, a depth of the groove being not less than a depth of the plated sublayer closest to the first surface in the multilayer flexible circuit board.
Claims20
A display panel, comprising:
- a flexible circuit board, wherein the flexible circuit board comprises a circuit substrate, and the circuit substrate is a multilayer flexible circuit board, wherein at least two layers of the multilayer flexible circuit board comprise plated sublayers, and a plurality of grooves are disposed in a first surface of the multilayer flexible circuit board, a depth of the groove being not less than a depth of the plated sublayer closest to the first surface in the multilayer flexible circuit board;
- and
- a chip circuit board, electrically connected to the flexible circuit board by a plurality of solder joints, wherein a securing adhesive is applied between the flexible circuit board and the chip circuit board, and the securing adhesive is at least distributed in gaps between the plurality of solder joints;
- wherein a plurality of grooves are disposed in at least one of a surface, close to the chip circuit board, of the flexible circuit board and a surface, close to the flexible circuit board, of the chip circuit board;
- and
- the solder joints are disposed between the plurality of grooves.
A display device, comprising a display panel, wherein the display panel comprises:
- a flexible circuit board, wherein the flexible circuit board comprises a circuit substrate, and the circuit substrate is a multilayer flexible circuit board, wherein at least two layers of the multilayer flexible circuit board comprise plated sublayers, and a plurality of grooves are disposed in a first surface of the multilayer flexible circuit board, a depth of the groove being not less than a depth of the plated sublayer closest to the first surface in the multilayer flexible circuit board;
- and
- a chip circuit board, electrically connected to the flexible circuit board by a plurality of solder joints, wherein a securing adhesive is applied between the flexible circuit board and the chip circuit board, and the securing adhesive is at least distributed in gaps between the plurality of solder joints;
- wherein a plurality of grooves are disposed in at least one of a surface, close to the chip circuit board, of the flexible circuit board and a surface, close to the flexible circuit board, of the chip circuit board;
- and
- the solder joints are disposed between the plurality of grooves.
Dependencies are inferred from the claim text.