H05K 2201/10742
Details of leads
H05K2201/10742 (Details of leads) appears on 1,430 US grants and 1,222 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,430
- Published applications
- 1,222
- Assignees
- 711
- Inventors
- 3,056
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 12 | 0 |
| 1977 | 12 | 0 |
| 1978 | 7 | 0 |
| 1979 | 4 | 0 |
| 1980 | 6 | 0 |
| 1981 | 5 | 0 |
| 1982 | 6 | 0 |
| 1983 | 6 | 0 |
| 1984 | 7 | 0 |
| 1985 | 10 | 0 |
| 1986 | 16 | 0 |
| 1987 | 26 | 0 |
| 1988 | 26 | 0 |
| 1989 | 24 | 0 |
| 1990 | 20 | 0 |
| 1991 | 36 | 0 |
| 1992 | 32 | 0 |
| 1993 | 21 | 0 |
| 1994 | 25 | 0 |
| 1995 | 33 | 0 |
| 1996 | 24 | 0 |
| 1997 | 27 | 0 |
| 1998 | 33 | 0 |
| 1999 | 39 | 0 |
| 2000 | 30 | 0 |
| 2001 | 35 | 20 |
| 2002 | 38 | 44 |
| 2003 | 28 | 32 |
| 2004 | 33 | 42 |
| 2005 | 38 | 66 |
| 2006 | 40 | 45 |
| 2007 | 45 | 67 |
| 2008 | 32 | 66 |
| 2009 | 41 | 69 |
| 2010 | 50 | 53 |
| 2011 | 34 | 44 |
| 2012 | 41 | 35 |
| 2013 | 29 | 35 |
| 2014 | 28 | 33 |
| 2015 | 26 | 45 |
| 2016 | 35 | 38 |
| 2017 | 47 | 34 |
| 2018 | 34 | 44 |
| 2019 | 40 | 39 |
| 2020 | 46 | 39 |
| 2021 | 28 | 64 |
| 2022 | 36 | 38 |
| 2023 | 57 | 39 |
| 2024 | 30 | 39 |
| 2025 | 30 | 34 |
| 2026 | 22 | 118 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor device, power conversion device, and method of manufacturing semiconductor device8 Sep 2026US 12,733,103 B2Mitsubishi Electric Corporation
- Electronic device including a substrate with an electronic component and a heat emitting body disposed on respective surfaces of the substrate25 Aug 2026US 12,720,666 B2LG Innotek Co., Ltd.
- Printed circuit board, manufacturing method thereof, and battery pack including the same4 Aug 2026US 12,701,656 B2LG Energy Solution, Ltd.
- Electrical component and method of forming same4 Aug 2026US 12,701,657 B2Medtronic, Inc.
- Systems and methods for a power electronics assembly of an imaging system4 Aug 2026US 12,701,681 B2GE Precision Healthcare LLC
- Lead electro-etching before plating to mitigate burr1 Oct 2026US 2026/0304630 A1
- Leadframe mounting with lead insertion for lead wall bonding17 Sep 2026US 2026/0282230 A1Semiconductor Components Industries, LLC
- Circuit board assembly and method of manufacturing the same27 Aug 2026US 2026/0255498 A1Avary Holding (Shenzhen) Co., Limited.
- Heat Sink Component Terminations20 Aug 2026US 2026/0247521 A1KYOCERA AVX Components Corporation
- Simultaneous Silicon Spring and Chip Singulation DRIE13 Aug 2026US 2026/0239987 A1
Most cited
By later US patents
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Encapsulated semiconductor device package having holes for electrically conductive material423US 5,608,265 AHitachi, Ltd. · 1997
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999