Leadframe mounting with lead insertion for lead wall bonding
AssigneeSemiconductor Components Industries, LLC
InventorsChad CHEN, Jiahui LIU, Wuxing XIA, Jingyan LIU
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Abstract
A semiconductor device package may include a substrate having an insulating layer with a patterned conductive layer formed thereon, the patterned conductive layer including at least a first pattern portion and a second pattern portion. The semiconductor device package may include a leadframe having a lead that is soldered to the substrate with solder provided in an opening between the first pattern portion and the second pattern portion and with the lead inserted into the opening.
Claims20
A semiconductor device package, comprising:
- a substrate having an insulating layer with a patterned conductive layer formed thereon, the patterned conductive layer including at least a first pattern portion and a second pattern portion;
- and
- a leadframe having a lead that is soldered to the substrate with solder provided in an opening between the first pattern portion and the second pattern portion and with the lead inserted into the opening.
A semiconductor device package, comprising:
- a substrate having an insulating layer with a patterned conductive layer formed thereon, the patterned conductive layer including at least a first pattern portion and a second pattern portion;
- and
- a leadframe positioned on the patterned conductive layer and having a lead with a lead end portion that is inserted into an opening between the first pattern portion and the second pattern portion, and that is soldered to at least one wall of the opening and to the insulating layer.
A semiconductor device package, comprising:
- a substrate having an insulating layer with a patterned conductive layer formed thereon, the patterned conductive layer including at least a first pattern portion and a second pattern portion;
- and
- a leadframe having a lead that is soldered to the insulating layer, the first pattern portion, and the second pattern portion using solder provided in an opening between the first pattern portion and the second pattern portion, with the lead inserted into the opening.
Dependencies are inferred from the claim text.