H05K 2201/1075
Shape details
H05K2201/1075 (Shape details) appears on 890 US grants and 762 published applications in this corpus.
Search patents in H05K- Granted patents
- 890
- Published applications
- 762
- Assignees
- 510
- Inventors
- 1,894
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 4 | 0 |
| 1978 | 4 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 4 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 3 | 0 |
| 1985 | 4 | 0 |
| 1986 | 7 | 0 |
| 1987 | 14 | 0 |
| 1988 | 18 | 0 |
| 1989 | 13 | 0 |
| 1990 | 13 | 0 |
| 1991 | 17 | 0 |
| 1992 | 14 | 0 |
| 1993 | 14 | 0 |
| 1994 | 11 | 0 |
| 1995 | 20 | 0 |
| 1996 | 14 | 0 |
| 1997 | 18 | 0 |
| 1998 | 20 | 0 |
| 1999 | 22 | 0 |
| 2000 | 20 | 0 |
| 2001 | 25 | 14 |
| 2002 | 24 | 32 |
| 2003 | 20 | 24 |
| 2004 | 27 | 28 |
| 2005 | 20 | 38 |
| 2006 | 30 | 28 |
| 2007 | 29 | 47 |
| 2008 | 22 | 38 |
| 2009 | 21 | 48 |
| 2010 | 27 | 36 |
| 2011 | 24 | 32 |
| 2012 | 31 | 22 |
| 2013 | 21 | 24 |
| 2014 | 17 | 21 |
| 2015 | 16 | 31 |
| 2016 | 25 | 25 |
| 2017 | 29 | 30 |
| 2018 | 23 | 33 |
| 2019 | 32 | 27 |
| 2020 | 29 | 28 |
| 2021 | 22 | 47 |
| 2022 | 29 | 23 |
| 2023 | 37 | 21 |
| 2024 | 18 | 24 |
| 2025 | 14 | 21 |
| 2026 | 12 | 20 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2201/10757Bent leadsIndexing code352
- H05K 2201/10878Means for retention of a lead in a holeIndexing code154
- H05K 2201/10871Leads having an integral insert stopIndexing code132
- H05K 2201/10818Flat leadsIndexing code123
- H05K 2201/1084Notched leadsIndexing code100
- H05K 2201/10856Divided leadsIndexing code75
- H05K 2201/10787Leads having protrusionsIndexing code69
- H05K 2201/1078Leads having locally deformed portionIndexing code64
All 13 subgroupsShow fewer
- H05K 2201/1081Special cross-section of a leadIndexing code46
- H05K 2201/10848Thinned leadsIndexing code38
- H05K 2201/10795Details of lead tipsIndexing code37
- H05K 2201/10863Adaptations of leads or holes for facilitating insertionIndexing code35
- H05K 2201/10803Tapered leads, i.e. leads having changing width or diameterIndexing code25
Recent patents
- Semiconductor device, power conversion device, and method of manufacturing semiconductor device8 Sep 2026US 12,733,103 B2Mitsubishi Electric Corporation
- Electronic device including a substrate with an electronic component and a heat emitting body disposed on respective surfaces of the substrate25 Aug 2026US 12,720,666 B2LG Innotek Co., Ltd.
- Systems and methods for a power electronics assembly of an imaging system4 Aug 2026US 12,701,681 B2GE Precision Healthcare LLC
- Printed circuit board, maintenance method therefor, and display apparatus28 Jul 2026US 12,696,388 B2Boe Technology Group Co., Ltd.
- Leadframe mounting with lead insertion for lead wall bonding9 Jun 2026US 12,652,759 B2Semiconductor Components Industries, LLC
- Lead electro-etching before plating to mitigate burr1 Oct 2026US 2026/0304630 A1
- Leadframe mounting with lead insertion for lead wall bonding17 Sep 2026US 2026/0282230 A1Semiconductor Components Industries, LLC
- Circuit board assembly and method of manufacturing the same27 Aug 2026US 2026/0255498 A1Avary Holding (Shenzhen) Co., Limited.
- Heat Sink Component Terminations20 Aug 2026US 2026/0247521 A1KYOCERA AVX Components Corporation
- Semiconductor storage device6 Aug 2026US 2026/0231336 A1Kioxia Corporation
Most cited
By later US patents
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Encapsulated semiconductor device package having holes for electrically conductive material423US 5,608,265 AHitachi, Ltd. · 1997
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999