H05K 2201/1078
Leads having locally deformed portion
Official title: Leads having locally deformed portion, e.g. for retention
H05K2201/1078 (Leads having locally deformed portion) appears on 64 US grants and 64 published applications in this corpus.
Search patents in H05K- Granted patents
- 64
- Published applications
- 64
- Assignees
- 35
- Inventors
- 112
- Latest grant
- 13 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 2 |
| 2002 | 0 | 1 |
| 2003 | 1 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 2 | 0 |
| 2015 | 1 | 1 |
| 2016 | 0 | 1 |
| 2017 | 3 | 7 |
| 2018 | 4 | 5 |
| 2019 | 3 | 3 |
| 2020 | 4 | 2 |
| 2021 | 1 | 27 |
| 2022 | 9 | 4 |
| 2023 | 22 | 4 |
| 2024 | 3 | 1 |
| 2025 | 0 | 0 |
| 2026 | 1 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package with guide pin13 Jan 2026US 12,525,519 B2Semiconductor Components Industries, LLC
- Electrical connector for attachment to textile24 Dec 2024US 12,176,639 B2Myant Inc.
- Circuit board soldering structure28 May 2024US 11,996,586 B2Panasonic Energy Co., Ltd.
- Shielding shell2 Jan 2024US 11,862,898 B2Dongguan Luxshare Technologies Co., Ltd
- Coated semiconductor devices17 Oct 2023US 11,791,248 B2Texas Instruments Incorporated
- Electrical Connector with Alignment and Retention Pins18 Jun 2026US 2026/0171695 A1TE Connectivity Solutions GmbH
- Semiconductor package with guide pin16 Apr 2026US 2026/0107853 A1Semiconductor Components Industries, LLC
- Electronical connector and press-fit terminal thereof19 Feb 2026US 2026/0051683 A1SDI Corporation
- Semiconductor device, and semiconductor device mounting body22 Aug 2024US 2024/0282681 A1Rohm Co., Ltd.
- Semiconductor package with guide pin5 Oct 2023US 2023/0317579 A1Semiconductor Components Industries, LLC
Most cited
By later US patents
- Semiconductor package with heat sink and method of fabrication118US 6,049,125 AMicron Technology, Inc. · 2000
- Semiconductor package with heat sink and method of fabrication116US 6,326,242 B1Micron Technology, Inc. · 2001
- Semiconductor device50US 6,169,325 AHitachi, Ltd. · 2001
- Substrate with terminal connections and method of making the same29US 4,110,904 AAllen-Bradley Company, Inc. · 1978
- Solder-bonding structure and brushless motor having the same15US 6,570,280 B2ASMO Co.LTD · 2003