Semiconductor package with heat sink and method of fabrication
AssigneeMicron Technology, Inc.
InventorsMike Brooks, Walter L. Moden
Life of this patent
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Abstract
A semiconductor package and method for fabricating the package are provided. The package includes a semiconductor die and a heat sink in thermal communication with the die. The heat sink includes one or more pad structures adapted to form bonded connections, and thermal paths to contacts on a substrate. The method includes forming multiple heat sinks on a frame similar to a lead frame, and etching or stamping the pad structures on the heat sink. The frame can then be attached to a leadframe containing encapsulated dice, and the assembly singulated to form separate packages. The packages can be used to form electronic assemblies such as circuit board assemblies and multi chip modules.
Claims34
A method for fabricating a semiconductor package comprising:
- providing a plurality of semiconductor dice on a leadframe;
- forming a plurality of heat sinks on a frame, each heat sink including a pad structure comprising at least one opening having a selected depth and configured to provide a bonding site for forming a bonded connection with the heat sink;
- attaching the heat sinks on the frame to the dice on the leadframe;
- singulating the frame and the leadframe into a plurality of separate packages.
A method for fabricating a semiconductor package comprising:
- providing a plurality of semiconductor dice on a leadframe;
- forming a plurality of heat sinks on a frame, each heat sink including a pad structure comprising at least one raised member with a selected height configured to provide a bonding site for forming a bonded connection with the heat sink;
- attaching the heat sinks on the frame to the dice on the leadframe;
- singulating the frame and the leadframe into a plurality of separate packages.
A method for fabricating a semiconductor package comprising:
- providing an encapsulated semiconductor die;
- providing a heat sink for the die comprising a pad structure configured to form a bonded connection between the heat sink and a substrate;
- attaching the heat sink to the die;
- and
- forming the bonded connection between the heat sink and the substrate.
A method for fabricating semiconductor packages comprising:
- providing a plurality of semiconductor dice on a leadframe;
- providing a plurality of heat sinks on a frame, each heat sink comprising a pad structure configured to form a bonded connection with a substrate;
- attaching the heat sinks on the frame to the dice on the leadframe;
- and
- following the attaching step, singulating the frame and the leadframe into the semiconductor packages.
A method for fabricating a semiconductor package comprising:
- providing a leadframe and a plurality of semiconductor dice on the leadframe;
- providing a frame comprising a plurality of heat sinks comprising metal plates configured for attachment to the dice on the leadframe;
- attaching the heat sinks on the frame to the dice on the leadframe;
- and
- singulating the frame and the leadframe into a plurality of separate packages including the package.
A method for fabricating semiconductor packages comprising:
- providing a frame comprising a pair of spaced side rails and a plurality of heat sinks comprising plates connected to the side rails and pad structures on the plates configured to bond the heat sinks to at least one substrate;
- providing a semiconductor leadframe;
- providing a plurality of encapsulated semiconductor dice on the leadframe;
- attaching the heat sinks on the frame to the encapsulated semiconductor dice on the leadframe;
- and
- singulating the frame and the leadframe into the packages, each package comprising an encapsulated semiconductor die, a heat sink attached to the die, and a pad structure on the heat sink.
Dependencies are inferred from the claim text.