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US 11,791,248 B2Granted
Coated semiconductor devices
AssigneeTexas Instruments Incorporated
InventorSreenivasan Kalyani Koduri
Life of this patent
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Abstract
In examples, a semiconductor device comprises a semiconductor die, an opaque mold compound housing covering the semiconductor die, a conductive terminal extending from the mold compound housing, and an insulative coat covering the mold compound housing and at least a portion of the conductive terminal.
Claims9
A method, comprising:
- providing a semiconductor device having a plastic housing and a conductive terminal extending from the plastic housing;
- covering the plastic housing and the conductive terminal with an insulative coat;
- performing a first curing of the insulative coat;
- using a solvent to remove the insulative coat from a portion of the conductive terminal;
- and
- performing a second curing of the insulative coat covering the plastic housing and the conductive terminal.
3 more elements
Dependencies are inferred from the claim text.