Circuit board soldering structure

A circuit board soldering structure comprising a circuit board having a slit hole provided therein, a conductive pattern provided on the circuit board along the slit hole, and a lead plate inserted into the slit hole of the circuit board, the lead plate being soldered to the conductive pattern, wherein

• the lead plate is made of an elastically-deformable metal plate thinner than an opening width of the slit hole,
• the lead plate includes an insertion section inserted into the slit hole, the insertion section including a bent section approaching from one of opposing inner surfaces of the slit hole facing each other toward another of the inner surfaces of the slit hole,
• the bent section is disposed in the slit hole,
• the insertion section has both surfaces that are close to or contact the inner surfaces of the slit hole and soldered to the conductive pattern,
• an inclined portion of the bent section which is inclined from a vertical direction in which the opposing inner surfaces of the slit hole extend is located between opposite ends of the slit hole in the vertical direction, and
• the insertion section includes a first part and a second part respectively extending from opposite ends of the inclined portion of the bent section in the vertical direction, wherein the first part is closer to the one of the opposing inner surfaces than the another of the opposing inner surfaces of the slit hole, and the second part is closer to the another of the opposing inner surfaces than the one of the opposing inner surfaces of the slit hole.