Semiconductor package with heat sink and method of fabrication
AssigneeMicron Technology, Inc.
InventorsMike Brooks, Walter L. Moden
Life of this patent
Estimating the term…
Abstract
A semiconductor package and method for fabricating the package are provided. The package includes a semiconductor die and a heat sink in thermal communication with the die. The heat sink includes one or more pad structures adapted to form bonded connections, and thermal paths to contacts on a substrate. The method includes forming multiple heat sinks on a frame similar to a lead frame, and etching or stamping the pad structures on the heat sink. The frame can then be attached to a leadframe containing encapsulated dice, and the assembly singulated to form separate packages. The packages can be used to form electronic assemblies such as circuit board assemblies and multi chip modules.
Claims36
A semiconductor package comprising:
- a semiconductor die;
- a heat sink in thermal communication with the die;
- and
- a pad structure on the heat sink configured to form a bonded connection with the heat sink, said pad structure comprising at least one opening in the heat sink to a selected depth.
A semiconductor package comprising:
- a semiconductor die;
- a heat sink in thermal communication with the die;
- and
- a pad structure on the heat sink, said pad structure comprising at least one opening in the heat sink to a selected depth, said pad structure and opening at least partially covered with a bonding layer configured to form a bonded connection with the heat sink.
A semiconductor package comprising:
- a semiconductor die;
- a heat sink in thermal communication with the die;
- and
- a pad structure on the heat sink, said pad structure comprising at least one raised member formed in the heat sink configured to form a bonded connection between the heat sink and a substrate.
A semiconductor package comprising:
- a semiconductor die;
- an encapsulant covering the die;
- a heat sink attached to the encapsulant in thermal communication with the die;
- and
- a pad structure on the heat sink configured to form a bonded connection with a substrate, said pad structure comprising at least one opening in the heat sink to a selected depth, and a bonding layer at least partially covering the pad structure.
A semiconductor package comprising:
- a semiconductor die;
- an encapsulant covering the die;
- a heat sink attached to the encapsulant in thermal communication with the die;
- and
- a pad structure on the heat sink configured to form a bonded connection with a substrate, said pad structure comprising at least one raised member on the heat sink with a selected height, and a bonding layer at least partially covering the pad structure.
An electronic assembly comprising:
- a substrate;
- a semiconductor package attached to the substrate, said package comprising a semiconductor die and a heat sink in thermal communication with the die, said heat sink comprising a pad structure including at least one opening in the heat sink to a selected depth;
- and
- a bonded connection between the pad structure and the substrate.
An electronic assembly comprising:
- a substrate;
- a semiconductor package attached to the substrate, said package comprising a semiconductor die and a heat sink in thermal communication with the die, said pad structure comprising at least one raised member formed on the heat sink configured to form a bonding site for attaching the package to the substrate;
- and
- a bonded connection between the pad structure and the substrate.
An electronic assembly comprising:
- a substrate having a contact formed thereon;
- a semiconductor package attached to the substrate, said package comprising a semiconductor die and a heat sink in thermal communication with the die, said heat sink comprising a pad structure including at least one opening in the heat sink to a selected depth;
- and
- a bonded connection between the pad structure and the contact, said bonded connection comprising a thermally conductive material bonded to the pad structure and to the contact, said material extending into the opening.
Dependencies are inferred from the claim text.