Semiconductor device

A semiconductor device comprising:

• a wiring board rectangular in shape having a plurality of wiring layers and a plurality of terminals connected to said plurality of wiring layers, said wiring board having a pair of long sides extending in a first direction and a pair of short sides extending in a second direction different from said first direction;
• a plurality of first semiconductor packages mounted on said wiring board;
• and
• a plurality of second semiconductor packages mounted on said wiring board;
• each of said plurality of first semiconductor packages and said plurality of second semiconductor packages having
• an insulating tape rectangular in shape having a device hole,
• a semiconductor chip rectangular in shape formed on a main surface thereof with an integrated circuit and a plurality of bonding pads, said semiconductor chip being arranged in said device hole of said insulating tape,
• a plurality of first leads formed on one surface of said insulating tape, each of said plurality of first leads having a first portion extending over said main surface of said semiconductor chip and a second portion formed integrally with said first portion and projecting from one long side of said insulating tape to outside, an end of said first portion being electrically connected to corresponding one of said plurality of bonding pads of said semiconductor chip,
• a support lead formed on one surface of said insulating tape and projecting from a short side of said insulating tape outside, and
• a resin layer for encapsulating said main surface of said semiconductor chip and said first portion of said first lead;
• wherein
• a tip of said second portion of said first lead of each of said plurality of first semiconductor packages and said plurality of second semiconductor packages is connected to corresponding one of said plurality of terminals of said wiring board,
• the tip of said support lead of each of said plurality of first semiconductor packages and said plurality of second semiconductor packages comes in contact with said wiring board,
• each of said plurality of first semiconductor packages and said plurality of second semiconductor packages is mounted on said wiring board with a predetermined tilt angle defined by the length of said support lead in a thickness direction of said wiring board,
• said plurality of first semiconductor packages are arranged from one long side of said wiring board along said second direction, the adjacent semiconductor packages overlapping each other in a planar manner,
• said plurality of second semiconductor packages are arranged from the other long side of said wiring board along said second direction, the adjacent semiconductor packages overlapping each other in a planar manner, and
• said plurality of first semiconductor packages and said plurality of second semiconductor packages are adjacently arranged in said first direction.