H05K 2201/10856
Divided leads
Official title: Divided leads, e.g. by slot in length direction of lead, or by branching of the lead
H05K2201/10856 (Divided leads) appears on 75 US grants and 73 published applications in this corpus.
Search patents in H05K- Granted patents
- 75
- Published applications
- 73
- Assignees
- 75
- Inventors
- 194
- Latest grant
- 25 Jun 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 1 |
| 2002 | 3 | 5 |
| 2003 | 4 | 5 |
| 2004 | 5 | 3 |
| 2005 | 2 | 2 |
| 2006 | 3 | 2 |
| 2007 | 2 | 5 |
| 2008 | 4 | 5 |
| 2009 | 2 | 4 |
| 2010 | 3 | 4 |
| 2011 | 1 | 1 |
| 2012 | 3 | 4 |
| 2013 | 2 | 5 |
| 2014 | 2 | 3 |
| 2015 | 3 | 2 |
| 2016 | 3 | 1 |
| 2017 | 0 | 1 |
| 2018 | 2 | 3 |
| 2019 | 1 | 1 |
| 2020 | 2 | 4 |
| 2021 | 3 | 5 |
| 2022 | 2 | 2 |
| 2023 | 3 | 2 |
| 2024 | 1 | 0 |
| 2025 | 0 | 1 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Solder surface features for integrated circuit packages25 Jun 2024US 12,021,011 B2Texas Instruments Incorporated
- Semiconductor module comprising a housing21 Nov 2023US 11,823,988 B2Siemens Aktiengesellschaft
- Connector with tolerance module4 Jul 2023US 11,695,227 B2Avic Jonhon Optronic Technology Co., Ltd
- Power distributor of an electrical system of a motor vehicle16 May 2023US 11,653,450 B2Ellenberger & Poensgen GmbH
- Pin side edge mount connector and systems and methods thereof30 Aug 2022US 11,431,117 B2Lockheed Martin Corporation
- Circuit board for receiving at least one contact pin, method for contacting a circuit board and circuit21 May 2026US 2026/0143590 A1Bizlink Industry Germany GmbH
- Drive device15 Jan 2026US 2026/0018964 A1Denso Corporation
- Press-fit terminal, terminal structure, and semiconductor module13 Feb 2025US 2025/0055210 A1Fuji Electric Co., Ltd.
- Semiconductor module comprising a housing13 Apr 2023US 2023/0111324 A1Siemens Aktiengesellschaft
- Solder surface features for integrated circuit packages2 Mar 2023US 2023/0069741 A1Texas Instruments Incorporated
Most cited
By later US patents
- Multi-connection via with electrically isolated segments154US 6,388,208 B1Teradyne, Inc. · 2002
- Passive component87US 5,921,820 ABC Components Holdings B.V. · 1999
- Split via surface mount connector and related techniques72US 6,137,064 ATeradyne, Inc. · 2000
- Deformable pin connector for multiple PC boards59US 5,761,050 ACTS Corporation · 1998
- Electrical connector for interconnecting printed circuit boards45US 4,446,505 AAMP Incorporated · 1984