Solder surface features for integrated circuit packages
AssigneeTexas Instruments Incorporated
InventorsAmirul Afiq Bin Hud, Wei Fen Sueann Lim, Adi Irwan Bin Herman
Life of this patent
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Abstract
One example described herein includes an integrated circuit (IC) package. The IC package includes a semiconductor die comprising an IC and an IC package enclosure that substantially encloses the semiconductor die. The IC package also includes at least one conductive metal contact. Each of the at least one conductive metal contact is coupled to the semiconductor die and comprises a planar solder surface exterior to the IC package enclosure to which the respective at least one metal contact is soldered to an external conductive metal contact. The planar solder surface includes at least one solder surface feature.
Claims16
An integrated circuit (IC) package comprising:
- a semiconductor die comprising an IC;
- an IC package enclosure that substantially encloses the semiconductor die;
- and
- a conductive metal contact coupled to the semiconductor die, the conductive metal contact including a planar solder surface exposed on an exterior surface of the IC package enclosure, the planar solder surface further including at least one concave oblong indentation in the planar solder surface that does not extend to any other surface of the conductive metal contact.
A method for fabricating an integrated circuit (IC) package, the method comprising:
- fabricating a semiconductor die that comprises an IC;
- forming a conductive metal contact comprising a planar solder surface;
- forming at least one concave oblong indentation in the planar solder surface that does not extend to any other surface of the conductive metal contact, the at least one concave oblong indentation being configured to increase surface area of contact of a solder material on the conductive metal contact relative to the planar solder surface;
- coupling the conductive metal contact to the semiconductor die;
- and
- forming an IC package enclosure over the semiconductor die and partially over the conductive metal contact to form the IC package.
An integrated circuit (IC) package comprising:
- a semiconductor die comprising an IC;
- an IC package enclosure that substantially encloses the semiconductor die;
- and
- at least one conductive metal contact on an exterior surface of the IC package enclosure, the conductive metal contact including a planar solder surface facing away from the IC package enclosure, the planar solder surface comprising at least one curved slot surrounded by the planar solder surface and configured to increase surface area of contact of a solder material on the at least one conductive metal contact relative to the planar solder surface.
Dependencies are inferred from the claim text.