Semiconductor module comprising a housing

A converter, comprising a semiconductor module, said semiconductor module comprising a housing, a pin arranged in the housing and including a first contact region which has a press-fit connection, a semiconductor component arranged in the housing and electrically conductively connected to the pin, a first substrate arranged in the housing and clamped in the housing via the pin by a non-positive locking connection, which, when formed, causes the press-fit connection to be deformed elastically and/or plastically with the first substrate, said first substrate having a first recess which is open and at least in part encompasses the pin in the first contact region, a metallic coating applied to the first substrate at least in a region of the first recess so as to electrically conductively connect the first substrate to the semiconductor component, and a second substrate in contact with the pin and connected within the housing in a non-releasable manner.

A method for producing a semiconductor module, said method comprising:

• connecting a first substrate in a non-positive locking manner to a pin by clamping in a housing;
• and
• subsequently connecting a second substrate to the pin.