Solder surface features for integrated circuit packages
AssigneeTexas Instruments Incorporated
InventorsAMIRUL AFIQ BIN HUD, WEI FEN SUEANN LIM, ADI IRWAN BIN HERMAN
Life of this patent
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Abstract
One example described herein includes an integrated circuit (IC) package. The IC package includes a semiconductor die comprising an IC and an IC package enclosure that substantially encloses the semiconductor die. The IC package also includes at least one conductive metal contact. Each of the at least one conductive metal contact is coupled to the semiconductor die and comprises a planar solder surface exterior to the IC package enclosure to which the respective at least one metal contact is soldered to an external conductive metal contact. The planar solder surface includes at least one solder surface feature.
Claims20
An integrated circuit (IC) package comprising:
- a semiconductor die comprising an IC;
- an IC package enclosure that substantially encloses the semiconductor die;
- and
- at least one conductive metal contact, each of the at least one conductive metal contact is coupled to the semiconductor die and comprises a planar solder surface exterior to the IC package enclosure to which the respective at least one metal contact is soldered to an external conductive metal contact, the planar solder surface comprising at least one solder surface feature.
A method for fabricating an integrated circuit (IC) package, the method comprising:
- fabricating a semiconductor die that comprises an IC;
- forming at least one conductive metal contact, each of the at least one conductive metal contact comprising a planar solder surface to which the respective at least one conductive metal contact is soldered to an external conductive metal contact;
- forming at least one solder surface feature in the planar solder surface, the at least one solder surface feature being configured to increase surface area of contact of a solder material on the at least one conductive metal contact relative to the planar solder surface;
- coupling the at least one conductive metal contact to the semiconductor die;
- and
- coupling the at least one conductive metal contact and the semiconductor die to an IC package enclosure to form the IC package.
An integrated circuit (IC) package comprising:
- a semiconductor die comprising an IC;
- an IC package enclosure that substantially encloses the semiconductor die;
- and
- at least one conductive metal contact, each of the at least one conductive metal contact is coupled to the semiconductor die and comprises a planar solder surface exterior to the IC package enclosure to which the respective at least one metal contact is soldered to an external conductive metal contact, the planar solder surface comprising at least one solder surface feature configured to increase surface area of contact of a solder material on the at least one conductive metal contact relative to the planar solder surface.
Dependencies are inferred from the claim text.