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US 11,431,117 B2Granted
Pin side edge mount connector and systems and methods thereof
AssigneeLockheed Martin Corporation
InventorsSamuel Muen Shyu, Raymond Yu, Robert James Hill
Life of this patent
Estimating the term…
Abstract
A printed circuit board (PCB) device including one or more insulating layers and one or more conducting layers arranged to form a layer stack; and one or more blind holes disposed along a side edge of the layer stack and parallel to a plane of the layer stack. Each of the one or more blind holes along the side edge of the layer stack is configured to receive a pin. Each pin can make an electrical connection with a corresponding blind hole.
Claims18
A printed circuit board (PCB) system, comprising:
- one or more insulating layers and one or more conducting layers arranged to form a layer stack;
- one or more blind holes disposed along a side edge of the layer stack and parallel to a plane of the layer stack;
- at least one pin;
- and
- a housing configured to hold the at least one pin and be removably mounted to the side edge of the layer stack, wherein
- each said at least one pin held by the housing is configured to be inserted into and retained by a respective one of the one or more blind holes,
- wherein a force asserted by a portion of the said at least one pin against the respective one of the one or more blind holes attaches the housing to the side edge of the layer stack.
4 more elements
A printed circuit board (PCB) system, comprising:
- a layer stack comprising one or more layers;
- one or more blind holes disposed in a side edge of the layer stack, each of the one or more blind holes having a depth that extends from the side edge into the layer stack in a direction parallel to a plane of a layer of the layer stack;
- and
- a housing comprising a side surface, the housing configured to hold one or more pins, wherein the one or more pins extend from the side surface of the housing and wherein the side surface of the housing is configured to mount to the side edge of the layer stack,
- wherein each of the one or more blind holes is configured to receive one of the one or more pins, and
- wherein the housing is disposed along a side edge of the layer stack and is not disposed over a top surface or a bottom surface of the layer stack.
3 more elements
A method comprising:
- providing a plurality of printed circuit boards (PCBs) forming a stack in a thickness direction of the plurality of PCBs, wherein the stack of PCBs has a top surface and a bottom surface opposite the top surface;
- providing one or more blind holes disposed in a side edge of at least one PCB of the plurality of PCBs, each of the one or more blind holes having a depth that extends from the side edge into the at least one PCB in a direction parallel to a plane of a layer of the at least one PCB;
- and
- providing a housing comprising a side surface, the housing configured to hold one or more pins, wherein the one or more pins extend from the side surface of the housing and wherein the side surface of the housing is configured to mount to the side edge of the at least one PCB,
- wherein each of the one or more blind holes is configured to receive one of the one or more pins, and
- wherein the housing is disposed along a side edge of each of the plurality of the PCBs and is not disposed over the top surface or the bottom surface of the stack of PCBs.
3 more elements
Dependencies are inferred from the claim text.