H05K 2201/10818
Flat leads
H05K2201/10818 (Flat leads) appears on 123 US grants and 97 published applications in this corpus.
Search patents in H05K- Granted patents
- 123
- Published applications
- 97
- Assignees
- 99
- Inventors
- 260
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 3 | 0 |
| 1995 | 0 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 5 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 1 |
| 2002 | 3 | 4 |
| 2003 | 4 | 3 |
| 2004 | 4 | 4 |
| 2005 | 1 | 1 |
| 2006 | 4 | 4 |
| 2007 | 4 | 6 |
| 2008 | 1 | 3 |
| 2009 | 3 | 8 |
| 2010 | 2 | 3 |
| 2011 | 6 | 6 |
| 2012 | 6 | 6 |
| 2013 | 4 | 0 |
| 2014 | 4 | 2 |
| 2015 | 3 | 3 |
| 2016 | 2 | 5 |
| 2017 | 4 | 4 |
| 2018 | 2 | 6 |
| 2019 | 3 | 4 |
| 2020 | 5 | 4 |
| 2021 | 5 | 2 |
| 2022 | 3 | 4 |
| 2023 | 4 | 2 |
| 2024 | 2 | 5 |
| 2025 | 3 | 6 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Systems and methods for a power electronics assembly of an imaging system4 Aug 2026US 12,701,681 B2GE Precision Healthcare LLC
- Electronic device7 Oct 2025US 12,439,523 B2Darwin Precisions Corporation
- Varying diameters of power-vias in a PCB based on via location12 Aug 2025US 12,389,538 B2Hewlett Packard Enterprise Development LP
- Electronic package and electronic device comprising the same5 Aug 2025US 12,381,135 B2Ampleon Netherlands B.V.
- Semiconductor device, printed circuit board (PCB), and method of interfacing control pin (gate pin) of a power semiconductor device (MOSFET) to a printed circuit board (PCB)3 Sep 2024US 12,080,634 B2The Noco Company
- Power Package Configured for Increased Power Density, Electrical Efficiency, and Thermal Performance2 Apr 2026US 2026/0096415 A1Wolfspeed, Inc.
- Varying diameters of power-vias in a pcb based on via location13 Nov 2025US 2025/0351269 A1Hewlett Packard Enterprise Development LP
- Wiring circuit board and method of producing the wiring circuit board30 Oct 2025US 2025/0338393 A1Nitto Denko Corporation
- Hard drive device and the heat dissipation unit for a hard drive device25 Sep 2025US 2025/0300034 A1Innodisk Corporation
- Systems and methods for a power electronics assembly of an imaging system25 Sep 2025US 2025/0301557 A1GE Precision Healthcare LLC
Most cited
By later US patents
- Encapsulated semiconductor device package having holes for electrically conductive material423US 5,608,265 AHitachi, Ltd. · 1997
- Process of forming a compliant lead frame for array-type semiconductor packages129US 4,751,199 AFairchild Semiconductor Corporation · 1988
- Flying leads for integrated circuits64US 5,195,237 ACray Computer Corporation · 1993
- Three dimensionally interconnected module assembly43US 5,045,975 ACray Computer Corporation · 1991
- Method of mounting a surface-mountable IC to a converter board40US 5,351,393 ADimensonal Circuits Corporation · 1994