Semiconductor device, printed circuit board (PCB), and method of interfacing control pin (gate pin) of a power semiconductor device (MOSFET) to a printed circuit board (PCB)

A printed circuit board (PCB) device, comprising;

• a printed circuit board having spaced apart copper plates;
• and
• a plurality of MOSFETs bridging the copper plates, the MOSFETs each comprising:
• a semiconductor body;
• a plurality of power pins extending outwardly from at least one side of the semiconductor body, the power pins having tips bent downwardly and connected to one of the spaced apart copper plates;
• a gate pin extending outwardly from at least one side of the semiconductor body,
• wherein the tip of the gate pin is elevated relative to the tips of the power pins so as to avoid electrical contact with the one of the spaced apart cooper plates, and
• wherein the tip of the gate pin is connected to a first end of a wire connector, the wire connector elevated relative to the spaced apart copper plates, wherein a second end of the wire connector is connected to a trace of the PCB.

A method of connecting a MOSFET to a printed circuit board (PCB), the method comprising:

• locating a tip of a gate pin of the MOSFET at an elevated position relative to tips of power pins of the MOSFET;
• installing the MOSFET bridging a pair of spaced apart copper plates located on the printed circuit board (PCB) with the tips of the power pins connected to one of the spaced apart copper plates and a metal connector of the MOSFET connected to the other of the spaced apart copper plates;
• electrically connecting the elevated tip of the gate pin to a first end of a connector wire or a gate printed circuit board, the first end of the connector wire or the gate printed circuit board elevated relative to the spaced apart copper plates;
• and
• providing a resilient material between the connection of the gate pin and a surface of the PCB, the resilient material mechanically stabilizing the gate pin.