Electronic package and electronic device comprising the same

An electronic package comprising:

• a package body;
• a heat-conducting substrate arranged inside the package body and having a bottom surface that is exposed to an outside of the package body, the heat-conducting substrate having associated therewith a minimum bounding box that surrounds the heat-conducting substrate;
• an electronic circuit arranged inside the package body and comprising a semiconductor die that has a bottom surface with which it is mounted to the heat-conducting substrate and an opposing upper surface;
• one or more leads partially extending from outside the package body to inside the package body and over the minimum bounding box, each lead having a first end that is arranged inside the package body;
• and
• one or more bondwires for connecting the first end(s) to the electronic circuit,
• wherein the heat-conducting substrate comprises one or more recesses or cut-outs underneath the one or more leads,
• wherein upper surface(s) of the first end(s) of the one or more leads substantially lie in a plane with the upper surface of the semiconductor die, said plane being parallel to the bottom surface of the heat-conducting substrate,
• wherein the one or more leads were parts of a lead frame that was used for the manufacturing of the electronic package,
• wherein prior to separating the electronic package, the one or more leads and the heat-conducting substrate were connected to a remainder of the lead frame,
• wherein said separating comprises breaking the connection between the one or more leads and the remainder of the lead frame and between the heat-conducting substrate and the remainder of the lead frame,
• wherein the electronic package comprises tie bar remnants connected at corners of the heat-conducting substrate,
• wherein prior to separating the electronic package, the heat-conducting substrate was connected to the remainder of the lead frame using the tie bars,
• wherein some or all of the one or more leads enter the package body at a height position relative to the bottom surface of the heat-conducting substrate that is greater than a height position of the first end(s) of those leads relative to the bottom surface of the heat-conducting substrate, and
• wherein each lead among said some or all of the one or more leads comprises:
• a first lead part that extends at least partially outside the package body and substantially parallel to the bottom surface of the heat-conducting substrate;
• a second lead part that extends inside the package body and substantially parallel to the bottom surface of the heat-conducting substrate;
• and
• a curved lead part that extends at least partially inside the package body and that connects the first and second lead parts.