Power Package Configured for Increased Power Density, Electrical Efficiency, and Thermal Performance
AssigneeWolfspeed, Inc.
InventorsShashwat Singh, Brice McPherson, Brandon Passmore, Ben Samples, Sayan Seal, Roberto Marcelo Schupbach
Life of this patent
Estimating the term…
Abstract
A power package includes at least one power substrate having at least one power trace, at least one power device on the at least one power trace, signal terminals, and at least one signal connection assembly. The at least one signal connection assembly includes at least one of the following: at least one signal trace that is thinner than the at least one power trace; at least one embedded routing layer within the at least one power substrate; and/or at least one routing layer on the at least one power substrate.
Claims40
A power package comprising:
- at least one power substrate having at least one power trace;
- at least one power device on the at least one power trace;
- signal terminals;
- and
- at least one signal connection assembly,
- wherein the at least one signal connection assembly comprises at least one of the following:
- at least one signal trace that is thinner than the at least one power trace;
- at least one embedded routing layer within the at least one power substrate;
- and/or
- at least one routing layer on the at least one power substrate.
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-42. (canceled)
A power package comprising:
- at least one power substrate having at least one power trace;
- at least one power device on the at least one power trace;
- signal terminals;
- and
- at least one signal connection assembly configured to reduce a signal loop trace area and increase a power loop area,
- wherein the at least one signal connection assembly comprises at least one of the following:
- at least one signal trace that is thinner than the at least one power trace;
- at least one embedded routing layer within the at least one power substrate;
- and/or
- at least one routing layer on the at least one power substrate.
-51. (canceled)
-57. (canceled)
-66. (canceled)
-90. (canceled)
A power package comprising:
- at least one power substrate having at least one power trace;
- at least one power device on the at least one power trace;
- signal terminals;
- and
- at least one signal connection assembly,
- wherein the at least one signal connection assembly is connected to at least one signal interconnect;
- wherein the at least one signal interconnect is further connected to at least one of the signal terminals;
- and
- wherein the at least one signal connection assembly comprises at least one of the following:
- at least one signal trace that is thinner than the at least one power trace;
- at least one embedded routing layer within the at least one power substrate;
- and/or
- at least one routing layer on the at least one power substrate.
-96. (canceled)
-102. (canceled)
-111. (canceled)
-179. (canceled)
Dependencies are inferred from the claim text.