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US 2025/0351269 A1Published application
Varying diameters of power-vias in a pcb based on via location
AssigneeHewlett Packard Enterprise Development LP
InventorBrian Mark Hostetler
Life of this patent
Estimating the term…
Abstract
An electronic device may comprise a printed circuit board (PCB) and a power source and processing circuitry mounted to the PCB. The PCB comprises one or more power planes and a plurality of power vias electrically connected to the power planes. The power sources are electrically connected to the power planes. The processing circuitry is electrically connected to the plurality of power vias through a plurality of interconnects. Respective diameters of the plurality of power vias vary based on location.
Claims14
1-9. (canceled)
An electronic device comprising:
- a printed circuit board (PCB) comprising a power plane and a plurality of power vias electrically connected to the power plane;
- a power source mounted to the PCB and electrically connected to the power plane;
- and
- an electronic component mounted to the PCB and electrically connected to the plurality of power vias;
- wherein the plurality of power vias are arranged in a plurality of zones comprising a first zone and a second zone, and
- wherein the power vias in the first zone each have a first diameter and the power vias in the second zone each have a second diameter.
3 more elements
A method, comprising:
- providing a printed circuit board comprising a power plane;
- and
- forming a plurality of power vias electrically connected to the power plane and varying diameters of the plurality of power vias based on location.
Dependencies are inferred from the claim text.