Back to results
US 4,751,199 AGranted
Process of forming a compliant lead frame for array-type semiconductor packages
AssigneeFairchild Semiconductor Corporation
InventorWilliam S. Phy
Life of this patent
Estimating the term…
Loading patent…
Loading patent…
AssigneeFairchild Semiconductor Corporation
InventorWilliam S. Phy
Estimating the term…
A lead frame that is suited for use on array types of integrated circuit packages to provide a high degree of compliance for absorbing mechanical stress induced by thermal changes includes a series of individual terminal elements that are connected in a strip form by means of break tabs disposed between adjacent elements. Each terminal element provides two spaced, generally parallel mounting surfaces that are resiliently connected to one another by means of an integral intermediate section. While the terminal elements are interconnected in strip form, one of the mounting surfaces of each element can be bonded to an associated attachment region on the semiconductor substrate. After all of the terminals of the strip have been so bonded, the break tabs between adjacent terminals can be removed to thereby separate the terminals from one another. The package which then results contains discrete compliant terminals which are suitable for subsequent surface attachment to the printed circuit board.
A method for attaching high compliance leads to a semiconductor package having bonding sites arranged in a matrix pattern on a surface thereof, for subsequent attachment to the surface of a printed circuit board having a corresponding matrix arrangement of mounting regions, comprising the steps of:
A method for mounting an integrated circuit package having bonding sites arranged in a matrix pattern on one surface thereof to a printed circuit board having a corresponding matrix arrangement of mounting regions in a manner which provides mechanical compliance to absorb stresses caused by relative movement between the integrated circuit package and the printed circuit board, comprising the steps of:
Dependencies are inferred from the claim text.