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US 12,389,538 B2Granted
Varying diameters of power-vias in a PCB based on via location
AssigneeHewlett Packard Enterprise Development LP
InventorBrian Mark Hostetler
Life of this patent
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Abstract
An electronic device may comprise a printed circuit board (PCB) and a power source and processing circuitry mounted to the PCB. The PCB comprises one or more power planes and a plurality of power vias electrically connected to the power planes. The power sources are electrically connected to the power planes. The processing circuitry is electrically connected to the plurality of power vias through a plurality of interconnects. Respective diameters of the plurality of power vias vary based on location.
Claims10
An electronic device comprising:
- a printed circuit board (PCB) comprising a power plane and a plurality of power vias electrically connected to the power plane;
- a power source mounted to the PCB and electrically connected to the power plane;
- and
- an electronic component mounted to the PCB and electrically connected to the plurality of power vias through a plurality of interconnects;
- wherein respective diameters of the plurality of power vias vary based on location;
- wherein the respective diameters of the plurality of power vias vary based on distances of the power vias from a reference point;
- wherein the electronic component comprises contact pads arranged in a pattern and electrically connected to the plurality of power vias by solder balls;
- wherein the reference point corresponds to a center of the pattern of the contact pads;
- and
- wherein the respective diameters of the plurality of power vias decrease as distances of the power vias from the center increase.
7 more elements
An electronic device comprising:
- a printed circuit board (PCB) comprising a power plane and a plurality of power vias electrically connected to the power plane;
- a power source mounted to the PCB and electrically connected to the power plane;
- and
- an electronic component mounted to the PCB and electrically connected to the plurality of power vias;
- wherein the plurality of power vias are arranged in a plurality of zones comprising a first zone and a second zone, and
- wherein the power vias in the first zone each have a first diameter and the power vias in the second zone each have a second diameter,
- wherein the electronic component comprises contact pads arranged in a pattern and electrically connected to the plurality of power vias by solder balls,
- wherein the plurality of zones are concentrically nested around the center of the pattern, and
- wherein, for each of the plurality of zones, the diameters of the power vias in the respective zone are smaller than the diameters of the power vias in any of the zones closer to the center of the pattern and larger than the diameters of the power vias in any of the zones farther from the center of the pattern.
6 more elements
Dependencies are inferred from the claim text.