H05K 2201/10787
Leads having protrusions
Official title: Leads having protrusions, e.g. for retention or insert stop
H05K2201/10787 (Leads having protrusions) appears on 69 US grants and 74 published applications in this corpus.
Search patents in H05K- Granted patents
- 69
- Published applications
- 74
- Assignees
- 58
- Inventors
- 142
- Latest grant
- 13 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 4 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 0 | 2 |
| 2003 | 2 | 0 |
| 2004 | 1 | 1 |
| 2005 | 1 | 1 |
| 2006 | 1 | 3 |
| 2007 | 0 | 2 |
| 2008 | 2 | 7 |
| 2009 | 4 | 3 |
| 2010 | 5 | 3 |
| 2011 | 3 | 7 |
| 2012 | 3 | 1 |
| 2013 | 2 | 2 |
| 2014 | 3 | 4 |
| 2015 | 1 | 4 |
| 2016 | 4 | 6 |
| 2017 | 5 | 6 |
| 2018 | 6 | 5 |
| 2019 | 5 | 0 |
| 2020 | 1 | 3 |
| 2021 | 0 | 1 |
| 2022 | 1 | 3 |
| 2023 | 2 | 2 |
| 2024 | 2 | 3 |
| 2025 | 2 | 1 |
| 2026 | 1 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package with guide pin13 Jan 2026US 12,525,519 B2Semiconductor Components Industries, LLC
- Power semiconductor device30 Dec 2025US 12,513,826 B2Hitachi Astemo, Ltd.
- Circuit connection device, rotating electric device, and circuit connection device manufacturing method4 Nov 2025US 12,463,498 B2Mitsubishi Electric Corporation
- Circuit board soldering structure28 May 2024US 11,996,586 B2Panasonic Energy Co., Ltd.
- Crimp terminal-equipped flexible printed circuit board and method for manufacturing same26 Mar 2024US 11,942,708 B2Nippon Mektron, Ltd.
- Semiconductor package with guide pin16 Apr 2026US 2026/0107853 A1Semiconductor Components Industries, LLC
- Semiconductor module and insert molding method19 Mar 2026US 2026/0082485 A1Fuji Electric Co., Ltd.
- Electronical connector and press-fit terminal thereof19 Feb 2026US 2026/0051683 A1SDI Corporation
- Press-fit terminal, terminal structure, and semiconductor module13 Feb 2025US 2025/0055210 A1Fuji Electric Co., Ltd.
- Board unit, memory system, and electronic device28 Nov 2024US 2024/0397627 A1Kioxia Corporation
Most cited
By later US patents
- Semiconductor device35US 4,951,124 AKabushiki Kaisha Toshiba · 1990
- Connector19US 5,240,422 ANEC Corporation · 1993
- Electrical connector assembly for mounting on a printed circuit board14US 5,076,804 AMolex Incorporated · 1991
- Electronic circuit component and mounting method therefor13US 5,398,165 ARohm Co., Ltd. · 1995
- Electrical connector having bus bars providing circuit board retention12US 5,411,404 AThe Whitaker Corporation · 1995