US 4,951,124 AGranted

Semiconductor device

AssigneeKabushiki Kaisha Toshiba

InventorHiromichi Sawaya

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Abstract

A single in line type semiconductor device is disclosed which has a plurality of lead-in wires extending from a package. In this semiconductor device, a heat sink is embedded in one surface of the package and an appropriate number of lead-in wires are bent on the other surface side of the package, to provide an offset array of the lead-in wires arranged in two rows. A projection is formed on the above appropriate number of lead-in wires on one surface side of the package, such that it extends in a direction perpendicular to that in which the lead-in wires extend. In this semi-conductor device, when the external lead-in wires are inserted into, and joined by means of soldering to a printed circuit board, the package is prevented from being inclined toward the heat sink side by the projection of the external lead-in wire, so that it may be set upright relative to the printed circuit board.

Claims3

Dependent claims

A semiconductor device comprising:

a package having a front surface, a back surface, and a bottom surface;
a heat sink disposed in said front surface and a semiconductor pellet disposed between said front and back surfaces;
a plurality of external lead-in wires extending from said bottom surface of said package, selected ones of said lead-in wires being bent at a predetermined interval toward said back surface of said package to form a first row of external lead-in wires, the remaining ones of said external lead-in wires forming a second row offset with respect to said first row;
and
projection means, formed on selected ones of said second row of external lead-in wires, for offsetting a force applied to said external lead-in wires by the weight of said heat sink to thereby prevent tilting of said package about said external lead-in wires and to prevent subsequently formed cracks in said pellet when the tilting is forcibly reversed, said projection means extending substantially perpendicular to respective ones of said outermost external lead-in wires toward said front surface of said package.

2 more elements

Dependencies are inferred from the claim text.