H05K 2201/1084
Notched leads
H05K2201/1084 (Notched leads) appears on 100 US grants and 84 published applications in this corpus.
Search patents in H05K- Granted patents
- 100
- Published applications
- 84
- Assignees
- 95
- Inventors
- 213
- Latest grant
- 25 Jun 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 4 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 5 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 4 | 0 |
| 1999 | 3 | 0 |
| 2000 | 5 | 0 |
| 2001 | 2 | 1 |
| 2002 | 4 | 3 |
| 2003 | 2 | 4 |
| 2004 | 5 | 7 |
| 2005 | 3 | 11 |
| 2006 | 7 | 6 |
| 2007 | 4 | 6 |
| 2008 | 4 | 10 |
| 2009 | 2 | 8 |
| 2010 | 5 | 11 |
| 2011 | 4 | 3 |
| 2012 | 6 | 3 |
| 2013 | 3 | 1 |
| 2014 | 1 | 0 |
| 2015 | 3 | 1 |
| 2016 | 1 | 1 |
| 2017 | 0 | 0 |
| 2018 | 1 | 0 |
| 2019 | 0 | 0 |
| 2020 | 1 | 2 |
| 2021 | 0 | 2 |
| 2022 | 1 | 2 |
| 2023 | 3 | 1 |
| 2024 | 1 | 0 |
| 2025 | 0 | 0 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Solder surface features for integrated circuit packages25 Jun 2024US 12,021,011 B2Texas Instruments Incorporated
- Short interconnect assembly with strip elastomer4 Jul 2023US 11,696,396 B2Jf Microtechnology Sdn. Bhd.
- Short interconnect assembly with strip elastomer13 Jun 2023US 11,674,977 B2Jf Microtechnology Sdn. Bhd.
- Semiconductor device and manufacturing method thereof24 Jan 2023US 11,562,970 B2Fuji Electric Co., Ltd.
- Short interconnect assembly with strip elastomer1 Mar 2022US 11,266,015 B2Jf Microtechnology Sdn. Bhd.
- Lead electro-etching before plating to mitigate burr1 Oct 2026US 2026/0304630 A1
- Solder surface features for integrated circuit packages2 Mar 2023US 2023/0069741 A1Texas Instruments Incorporated
- Short interconnect assembly with strip elastomer8 Dec 2022US 2022/0390488 A1Jf Microtechnology Sdn. Bhd.
- Short interconnect assembly with strip elastomer12 May 2022US 2022/0151063 A1Jf Microtechnology Sdn. Bhd.
- Short interconnect assembly with strip elastomer16 Dec 2021US 2021/0392746 A1Jf Microtechnology Sdn. Bhd.
Most cited
By later US patents
- Surface mount plastic package semiconductor integrated circuit, manufacturing method thereof, as well as mounting method and mounted structure thereof247US 4,920,074 AHitachi, Ltd. · 1990
- Leadframe adapted to support semiconductor elements192US 5,391,439 ADai Nippon Printing Co.Ltd. · 1995
- Semiconductor package with heat sink and method of fabrication118US 6,049,125 AMicron Technology, Inc. · 2000
- Semiconductor package with heat sink and method of fabrication116US 6,326,242 B1Micron Technology, Inc. · 2001
- Semiconductor device and method of producing the same99US 5,519,251 AFujitsu Limited · 1996