Semiconductor device and manufacturing method thereof

A semiconductor device manufacturing method comprising:

• preparing a semiconductor module including
• a semiconductor chip,
• a case which stores the semiconductor chip, the case having a front surface,
• a plurality of external terminals electrically connected to the semiconductor chip, and extending upward from the front surface of the case, and
• a reference pin extending upward from the front surface of the case, and
• a positioning member having a reference hole and a plurality of supporting holes penetrating therethrough, the positioning member having a front surface and a rear surface opposite to each other;
• attaching the positioning member to the semiconductor module by
• setting the rear surface of the positioning member to face the front surface of the case, and
• inserting the reference pin and the plurality of external terminals respectively into the reference hole and the plurality of supporting holes, such that the reference pin is held in the reference hole, and the rear surface of the positioning member is maintained at a first height from the front surface of the case;
• heating the semiconductor module to which the positioning member has been attached;
• separately preparing a printed board having a plurality of terminal holes that respectively correspond to the plurality of external terminals;
• mounting the printed board on the front surface of the positioning member, and inserting the plurality of external terminals, extending from the front surface of the positioning member, into the plurality of terminal holes in the printed board;
• and
• pressing the printed board toward the front surface of the case to attach the printed board to the plurality of external terminals.