Leadframe adapted to support semiconductor elements

A leadframe provided with a plurality of outer lead sections of an elongated shape having outer ends to be cut along a cutting line before mounting, by soldering, said outer lead sections on a printed circuit board, each of said outer lead sections being formed with half-etched recess means for providing means for receiving solder in a soldering region including said cutting line, each of said outer lead sections having a length, two side edges, a thickness and opposite front and rear major surfaces, said rear major surface being adapted to be soldered to said printed circuit board in face-to-face contact, said recess means comprising a pair of elongated, substantially rectangular cutouts formed in said front major surface and extending along the respective side edges of each outer lead section transversely to said cutting line, each of said cutouts having a substantially flat, elongated bottom which extends along said length in substantially parallel relation to said major surfaces and which is located in an intermediate position of said thickness.

A leadframe provided with a plurality of outer lead sections of an elongated shape having outer ends to be cut along a cutting line before mounting, by soldering, said outer lead sections on a printed circuit board, each of said outer lead sections being formed with half-etched recess means for providing means for receiving solder in a soldering region including said cutting line, each of said outer lead sections having a length, two side edges, a thickness and opposite front and rear major surfaces, said rear major surface being adapted to be soldered to said printed circuit board in face-to-face contact, said recess means comprising a pair of elongated, substantially rectangular cutouts formed in said rear major surface and extending along the respective side edges of each outer lead section transversely to said cutting line, each of said cutouts having a substantially flat, elongated bottom which extends along said length in substantially parallel relation to said major surfaces and which is located in an intermediate position of said thickness.

A leadframe provided with a plurality of outer lead sections of an elongated shape having outer ends to be cut along a cutting line before mounting, by soldering, said outer lead sections on a printed circuit board, each of said outer lead sections being formed with half-etched elongated recess means which provide means for receiving solder in a soldering region including said cutting line, each of said outer lead sections having a length, a width and opposite major surfaces, said recess means extending transversely to said cutting line and having a substantially flat, elongated bottom which extends along said length in substantially parallel relation to said major surfaces, said recess means being of an elongated shape and extending along two sides of each outer lead section, respectively.