H05K 2201/10878
Means for retention of a lead in a hole
H05K2201/10878 (Means for retention of a lead in a hole) appears on 154 US grants and 99 published applications in this corpus.
Search patents in H05K- Granted patents
- 154
- Published applications
- 99
- Assignees
- 87
- Inventors
- 258
- Latest grant
- 9 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 6 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 6 | 0 |
| 1999 | 12 | 0 |
| 2000 | 7 | 0 |
| 2001 | 10 | 7 |
| 2002 | 5 | 7 |
| 2003 | 5 | 3 |
| 2004 | 6 | 5 |
| 2005 | 5 | 5 |
| 2006 | 8 | 4 |
| 2007 | 4 | 6 |
| 2008 | 2 | 5 |
| 2009 | 4 | 3 |
| 2010 | 4 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 0 |
| 2013 | 1 | 6 |
| 2014 | 5 | 3 |
| 2015 | 2 | 5 |
| 2016 | 2 | 2 |
| 2017 | 3 | 6 |
| 2018 | 4 | 4 |
| 2019 | 5 | 3 |
| 2020 | 5 | 4 |
| 2021 | 1 | 6 |
| 2022 | 6 | 2 |
| 2023 | 3 | 3 |
| 2024 | 1 | 3 |
| 2025 | 3 | 2 |
| 2026 | 2 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Leadframe mounting with lead insertion for lead wall bonding9 Jun 2026US 12,652,759 B2Semiconductor Components Industries, LLC
- VGA monitor emulating printed circuit board10 Feb 2026US 12,550,262 B2Alcon Inc.
- Connector for connecting an electrical termination on a printed circuit, corresponding assembly methods30 Dec 2025US 12,512,611 B2Banks and Acquirers International Holding
- Transfer molded power modules and methods of manufacture18 Nov 2025US 12,476,397 B2Semiconductor Components Industries, LLC
- Circuit connection device, rotating electric device, and circuit connection device manufacturing method4 Nov 2025US 12,463,498 B2Mitsubishi Electric Corporation
- Leadframe mounting with lead insertion for lead wall bonding17 Sep 2026US 2026/0282230 A1Semiconductor Components Industries, LLC
- Transfer molded power modules and methods of manufacture12 Mar 2026US 2026/0074448 A1Semiconductor Components Industries, LLC
- Electronical connector and press-fit terminal thereof19 Feb 2026US 2026/0051683 A1SDI Corporation
- Semiconductor module and a method for coupling a semiconductor module with a printed circuit board12 Feb 2026US 2026/0045714 A1
- Cable assembly, circuit board, connecting structure and electronic device16 Oct 2025US 2025/0323435 A1Zte Corporation
Most cited
By later US patents
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999
- Method of fabricating an interconnection element335US 6,336,269 B12002