Transfer molded power modules and methods of manufacture

A method for producing an electronic device assembly, the method comprising:

• coupling a first side of a substrate with a thermal-dissipation appliance, the substrate being arranged in a plane;
• and
• after coupling the substrate with the thermal-dissipation appliance:
• coupling a plurality of semiconductor die with a second side of the substrate, the second side being opposite the first side;
• coupling at least one conductive clip with the second side of the substrate and at least one semiconductor die of the plurality of semiconductor die;
• and
• coupling at least one signal pin with the second side of the substrate, the at least one signal pin including:
• a proximal end portion coupled with the second side of the substrate;
• a distal end portion;
• and
• a medial portion disposed between the proximal end portion and the distal end portion, the medial portion being pre-molded in a molding compound,
• the proximal end portion and the distal end portion excluding the molding compound, and
• the at least one signal pin being arranged along a longitudinal axis that is orthogonal to the plane of the substrate.

An electronic device assembly comprising:

• a thermal-dissipation appliance;
• a substrate arranged in a plane, the substrate having a first side coupled with the thermal-dissipation appliance and a second side opposite the first side;
• a plurality of semiconductor die disposed on the second side of the substrate;
• and
• a plurality of signal pins, each signal pin of the plurality of signal pins including:
• a proximal end portion coupled with the second side of the substrate;
• a distal end portion;
• and
• a medial portion disposed between the proximal end portion and the distal end portion, the medial portion being pre-molded in a molding compound, the proximal end portion and the distal end portion excluding the molding compound,
• each signal pin of the plurality of signal pins being arranged along a respective longitudinal axis that is orthogonal to the plane of the substrate.