H05K 2201/10757
Bent leads
H05K2201/10757 (Bent leads) appears on 352 US grants and 294 published applications in this corpus.
Search patents in H05K- Granted patents
- 352
- Published applications
- 294
- Assignees
- 231
- Inventors
- 752
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 5 | 0 |
| 1988 | 13 | 0 |
| 1989 | 6 | 0 |
| 1990 | 5 | 0 |
| 1991 | 4 | 0 |
| 1992 | 2 | 0 |
| 1993 | 7 | 0 |
| 1994 | 7 | 0 |
| 1995 | 7 | 0 |
| 1996 | 3 | 0 |
| 1997 | 10 | 0 |
| 1998 | 7 | 0 |
| 1999 | 12 | 0 |
| 2000 | 10 | 0 |
| 2001 | 13 | 7 |
| 2002 | 8 | 12 |
| 2003 | 7 | 7 |
| 2004 | 8 | 9 |
| 2005 | 6 | 14 |
| 2006 | 12 | 15 |
| 2007 | 16 | 21 |
| 2008 | 9 | 13 |
| 2009 | 12 | 16 |
| 2010 | 7 | 9 |
| 2011 | 5 | 9 |
| 2012 | 10 | 11 |
| 2013 | 8 | 6 |
| 2014 | 7 | 9 |
| 2015 | 5 | 12 |
| 2016 | 10 | 15 |
| 2017 | 13 | 10 |
| 2018 | 7 | 17 |
| 2019 | 15 | 10 |
| 2020 | 15 | 8 |
| 2021 | 9 | 10 |
| 2022 | 7 | 12 |
| 2023 | 8 | 11 |
| 2024 | 11 | 11 |
| 2025 | 7 | 9 |
| 2026 | 8 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor device, power conversion device, and method of manufacturing semiconductor device8 Sep 2026US 12,733,103 B2Mitsubishi Electric Corporation
- Electronic device including a substrate with an electronic component and a heat emitting body disposed on respective surfaces of the substrate25 Aug 2026US 12,720,666 B2LG Innotek Co., Ltd.
- Printed circuit board, maintenance method therefor, and display apparatus28 Jul 2026US 12,696,388 B2Boe Technology Group Co., Ltd.
- Leadframe mounting with lead insertion for lead wall bonding9 Jun 2026US 12,652,759 B2Semiconductor Components Industries, LLC
- Half-bridge switch arrangement12 May 2026US 12,628,303 B2SEG Automotive Germany GmbH
- Leadframe mounting with lead insertion for lead wall bonding17 Sep 2026US 2026/0282230 A1Semiconductor Components Industries, LLC
- Heat Sink Component Terminations20 Aug 2026US 2026/0247521 A1KYOCERA AVX Components Corporation
- Semiconductor storage device6 Aug 2026US 2026/0231336 A1Kioxia Corporation
- Electronic device and metal heat dissipation9 Jul 2026US 2026/0197931 A1Wistron Neweb Corp.
- Electronic device30 Apr 2026US 2026/0122763 A1LG Innotek Co., Ltd.
Most cited
By later US patents
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999
- Method of mounting resilient contact structures to semiconductor devices254US 5,829,128 AFormFactor, Inc. · 1998