Half-bridge switch arrangement

A half-bridge switch arrangement (1, 100), comprising:

• a high-side switch (10, 110) comprising a plurality of parallel-connected first semiconductor switching elements (11, 111),
• a low-side switch (20, 120) comprising a plurality of parallel-connected second semiconductor switching elements (21, 121),
• a positive busbar (130), to which a first terminal of each of the first semiconductor switching elements (11, 111) of the high-side switch (10, 110) is electrically connected,
• a negative busbar (140), to which a second terminal of each of the second semiconductor switching elements (21, 121) of the low-side switch (20, 120) is electrically connected, and
• a heat sink (180),
• wherein the heat sink (180) has a recess (181), a first plateau section (182) which is elevated relative to the recess (181) and a second plateau section (183) which is elevated relative to the recess (181), wherein the recess (181) is bounded by the first and second plateau sections (182, 183),
• wherein the heat sink is formed in a stepped shape, with the first plateau section forming a first step, with the recess adjoining the first plateau section forming a second step that is lower than the first step, and with the second plateau section adjoining the recess forming a third step that is higher than the second step,
• wherein the first semiconductor switching elements (11, 111) and the second semiconductor switching elements (21, 121) are arranged on an upper side (182′, 183′) of the first and second plateau sections (182, 183),
• wherein the positive busbar (130) and the negative busbar (140) are arranged one above the other within the recess (181).