H05K 2201/10772
Leads of a surface mounted component bent for providing a gap between
Official title: Leads of a surface mounted component bent for providing a gap between the lead and the pad during soldering
H05K2201/10772 (Leads of a surface mounted component bent for providing a gap between) appears on 48 US grants and 29 published applications in this corpus.
Search patents in H05K- Granted patents
- 48
- Published applications
- 29
- Assignees
- 40
- Inventors
- 125
- Latest grant
- 16 May 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 5 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 1 |
| 2002 | 3 | 2 |
| 2003 | 1 | 2 |
| 2004 | 1 | 0 |
| 2005 | 1 | 3 |
| 2006 | 1 | 2 |
| 2007 | 3 | 2 |
| 2008 | 2 | 1 |
| 2009 | 1 | 1 |
| 2010 | 0 | 3 |
| 2011 | 1 | 1 |
| 2012 | 1 | 0 |
| 2013 | 1 | 1 |
| 2014 | 0 | 1 |
| 2015 | 1 | 2 |
| 2016 | 1 | 2 |
| 2017 | 2 | 1 |
| 2018 | 0 | 1 |
| 2019 | 1 | 1 |
| 2020 | 2 | 0 |
| 2021 | 0 | 1 |
| 2022 | 0 | 0 |
| 2023 | 1 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 0 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Power distributor of an electrical system of a motor vehicle16 May 2023US 11,653,450 B2Ellenberger & Poensgen GmbH
- Ceramic electronic component and mounting structure therefor7 Apr 2020US 10,614,954 B2Murata Manufacturing Co., Ltd.
- Wiring board, electric motor, electric apparatus, and air conditioner24 Mar 2020US 10,601,285 B2Mitsubishi Electric Corporation
- Adapter with an insulating body having a circuit board with a plurality of conductive modules surface mounted on the board22 Jan 2019US 10,187,988 B1Chief Land Electronic Co., Ltd.
- Multilayer ceramic electronic component and board having the same14 Nov 2017US 9,818,541 B2Samsung Electro-Mechanics Co., Ltd.
- Flexible mounting structures for surface mount components2 Apr 2026US 2026/0096027 A1Intel Corporation
- Power distributor of an electrical system of a motor vehicle23 Sep 2021US 2021/0291766 A1Ellenberger & Poensgen GmbH
- Adapter with an insaulating body having a circuit board with a plurality of conductive modules surface mounted on the board14 Feb 2019US 2019/0053376 A1Chief Land Electronic Co., Ltd.
- Ceramic electronic component and mounting structure therefor27 Dec 2018US 2018/0374640 A1Murata Manufacturing Co., Ltd.
- Wiring board, electric motor, electric apparatus, and air conditioner5 Oct 2017US 2017/0288509 A1Mitsubishi Electric Corporation
Most cited
By later US patents
- Lead grid array integrated circuit91US 5,210,939 AIntel Corporation · 1993
- Apparatus having inner layers supporting surface-mount components86US 5,543,586 AThe Panda Project · 1996
- Lead frame and semiconductor device using the same54US 5,041,901 AHitachi, Ltd. · 1991
- Surface mounting connector50US 4,628,410 AITT Corporation · 1986
- Method of mounting a surface-mountable IC to a converter board40US 5,351,393 ADimensonal Circuits Corporation · 1994