Ceramic electronic component and mounting structure therefor

A mounting structure for a ceramic electronic component, wherein

• the ceramic electronic component includes:
• an element body including a first main surface and a second main surface that are opposed to one another;
• an electronic component body including a first outer electrode provided on the element body, and a second outer electrode provided on the element body;
• a first metal terminal connected to the first outer electrode;
• a second metal terminal connected to the second outer electrode;
• and
• an outer resin material that covers the electronic component body, the first and second outer electrodes, a portion of the first metal terminal, and a portion of the second metal terminal;
• wherein
• the second main surface of the element body is located on a side near a mounting surface of a mounting substrate on which the ceramic electronic component is to be mounted;
• the first metal terminal includes:
• a first terminal joint portion that is connected to the first outer electrode;
• a first extension portion that is connected to the first terminal joint portion and that defines a gap between the second main surface of the electronic component body and the mounting surface of the mounting substrate;
• and
• a first mount portion that is connected to the first extension portion and that extends toward a side opposite to the electronic component body;
• the second metal terminal includes:
• a second terminal joint portion that is connected to the second outer electrode;
• a second extension portion that is connected to the second terminal joint portion and that defines a gap between the second main surface of the electronic component body and the mounting surface of the mounting substrate;
• and
• a second mount portion that is connected to the second extension portion and that extends toward a side opposite to the electronic component body;
• the outer resin material includes a protruding portion;
• the first mount portion includes a first protrusion that protrudes toward the mounting surface;
• the second mount portion includes a second protrusion that protrudes toward the mounting surface;
• vertices of the first protrusion, the second protrusion, and the protruding portion are joined to the mounting surface of the mounting substrate;
• the joining is performed by welding to the mounting surface of the mounting substrate from a first recess on a side opposite to the mounting surface of the mounting substrate at a position of the first protrusion;
• and
• the joining is performed by welding to the mounting surface of the mounting substrate from a second recess on a side opposite to the mounting surface of the mounting substrate at a position of the second protrusion.