Lead grid array integrated circuit
AssigneeIntel Corporation
InventorsDebendra Mallik, Bidyut K. Bhattacharyya
Life of this patent
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Abstract
A method for attaching an array of flexible leads to the bottom of an integrated circuit package. There is provided a sheet of electrically conductive material. A plurality of slots are punched into the sheet, such that there is formed a plurality of beams. The beams are then bent into a spring shape. The sheet is placed over an integrated circuit package which has an array of contact pads extending across a bottom surface of the package. The beams are aligned and attached to the contact pads. The beams are then cut and separated from the remainder of the sheet. The sheet is removed, wherein there is constructed an integrated circuit package that has a two dimensional array of flexible leads.
Claims21
A method of constructing an integrated circuit package, comprising the steps of:
- a) providing a module having a plurality of contact pads;
- b) providing a sheet of electrically conductive material;
- c) removing portions of said sheet so that there is created a two dimensional array of beams;
- d) bending said beams;
- e) placing said sheet adjacent to said module so that all of said beams are aligned with said contact pads;
- f) attaching base portions of said beams to said contact pads;
- g) cutting said base portions to separate said beams from said sheet;
- and,
- h) removing said sheet from said module.
A method of constructing an integrated circuit package, comprising the steps of:
- a) providing a module having a plurality of contact pads and at least two alignment studs;
- b) providing a sheet of electrically conductive material having at least two alignment holes;
- c) removing portions of said sheet so that there is created a two-dimensional array of beams;
- d) bending said beams;
- e) placing said sheet over said module such that said alignment studs extend through said alignment holes and said sheet is adjacent ot said module, such that all of said beams are aligned with said contact pads;
- e) attaching base portions of said beams to said contact pads;
- f) cutting said base portions to separate said beams from said sheet;
- and,
- g) removing said sheet from said module.
Dependencies are inferred from the claim text.