H05K 2201/10765
Leads folded back, i.e. bent with an angle of 180 deg
H05K2201/10765 (Leads folded back, i.e. bent with an angle of 180 deg) appears on 20 US grants and 23 published applications in this corpus.
Search patents in H05K- Granted patents
- 20
- Published applications
- 23
- Assignees
- 23
- Inventors
- 58
- Latest grant
- 3 Jun 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 1 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 2 |
| 2006 | 1 | 1 |
| 2007 | 1 | 3 |
| 2008 | 0 | 1 |
| 2009 | 0 | 2 |
| 2010 | 2 | 0 |
| 2011 | 0 | 1 |
| 2012 | 1 | 2 |
| 2013 | 0 | 2 |
| 2014 | 0 | 2 |
| 2015 | 1 | 2 |
| 2016 | 1 | 1 |
| 2017 | 2 | 0 |
| 2018 | 0 | 1 |
| 2019 | 0 | 0 |
| 2020 | 1 | 0 |
| 2021 | 0 | 1 |
| 2022 | 1 | 0 |
| 2023 | 0 | 1 |
| 2024 | 0 | 0 |
| 2025 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Wiring base and electronic device3 Jun 2025US 12,322,700 B2KYOCERA Corporation
- Top-to-bottom interconnects with molded lead-frame module for integrated-circuit packages3 May 2022US 11,322,434 B2Intel Corporation
- Electrical component package with reinforced molded pins7 Jan 2020US 10,531,573 B2XFMRS, Inc.
- Miniature SMT housing for electronics package29 Aug 2017US 9,750,139 B2Circor Aerospace, Inc.
- Three-dimensional stack of leaded package and electronic member4 Jul 2017US 9,698,083 B2Infineon Technologies AG
- Wiring base and electronic device23 Feb 2023US 2023/0057427 A1KYOCERA Corporation
- Top-to-bottom interconnects with molded lead-frame module for integrated-circuit packages25 Feb 2021US 2021/0057318 A1Intel Corporation
- Electrical component package with reinforced molded pins3 May 2018US 2018/0122547 A1XFMRS, Inc.
- Miniature smt housing for electronics package22 Dec 2016US 2016/0374214 A1Circor Aerospace, Inc.
- Three-dimensional stack of leaded package and electronic member3 Dec 2015US 2015/0348882 A1Infineon Technologies AG
Most cited
By later US patents
- Injection molded circuit housing25US 4,766,520 ACapsonic Group, Inc. · 1988
- Multiconductor electrical cable terminations and methods and apparatus for making same17US 4,679,868 AE. I. Du Pont de Nemours and Company · 1987
- Multiconductor electrical cable terminations and methods and apparatus for making same14US 4,753,005 AE. I. Du Pont de Nemours and Company · 1988
- Press-fit fixing terminal, and electronic component having the same terminal8US 7,210,969 B1Matsushita Electric Industrial Co., Ltd. · 2007
- Light source unit, backlight unit and liquid crystal display including the same, and method thereof6US 7,766,499 B2Samsung Electronics Co., Ltd. · 2010