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US 2015/0348882 A1Published application
Three-dimensional stack of leaded package and electronic member
AssigneeInfineon Technologies AG
InventorAlfred Swain Hong YEO
Life of this patent
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Abstract
An electronic device comprising a package comprising an encapsulated electronic chip, at least one at least partially exposed electrically conductive carrier lead for mounting the package on and electrically connecting the electronic chip to a carrier, and at least one at least partially exposed electrically conductive connection lead, and an electronic member stacked with the package so as to be mounted on and electrically connected to the package by the at least one connection lead.
Claims20
An electronic device, the device comprising:
- a package comprising an encapsulated electronic chip, at least one at least partially exposed electrically conductive carrier lead for mounting the package on and electrically connecting the electronic chip to a carrier, and at least one at least partially exposed electrically conductive connection lead;
- an electronic member stacked with the package so as to be mounted on and electrically connected to the package by the at least one connection lead.
A method of manufacturing an electronic device, the method comprising:
- providing a package comprising an encapsulated electronic chip, at least one at least partially exposed electrically conductive carrier lead for mounting the package on and electrically connecting the electronic chip to a carrier, and at least one at least partially exposed electrically conductive connection lead;
- stacking an electronic member with the package to thereby mount the electronic member on and electrically connect the electronic member to the package by the at least one connection lead.
Dependencies are inferred from the claim text.