Top-to-bottom interconnects with molded lead-frame module for integrated-circuit packages
AssigneeIntel Corporation
InventorsJiun Hann Sir, Poh Boon Khoo, Eng Huat Goh
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Abstract
Disclosed embodiments include folded, top-to-bottom interconnects that couple a die side of an integrated-circuit package substrate, to a board as a complement to a ball-grid array for a flip-chip-mounted integrated-circuit die on the die side. The folded, top-to-bottom interconnect is in a molded frame that forms a perimeter around an infield to receive at least one flip-chip IC die. Power, ground and I/O interconnections shunt around the package substrate, and such shunting includes voltage regulation that need not be routed through the package substrate.
Claims23
An integrated-circuit package assembly, comprising:
- an integrated-circuit package substrate including a die side and a land side;
- a central bump-pad array on the die side;
- a peripheral interconnect array on the die side;
- a folded interconnect coupled to the die side, wherein the folded interconnect is coupled to a peripheral interconnect of the peripheral interconnect array, wherein the folded interconnect is in a frame, and wherein the folded interconnect includes a terminal end that extends below the land side;
- and wherein the bump-pad array is in an infield surrounded by the frame, further including:
- an integrated-circuit die on the die side, wherein the integrated-circuit die is coupled to a plurality of folded interconnects, and wherein the integrated-circuit die is coupled to the land side through the integrated-circuit package substrate;
- and wherein plurality of folded interconnects are coupled to a chipset on a board, including a voltage regulator on the board.
An integrated-circuit package assembly, comprising:
- an integrated-circuit package substrate including a die side and a land side;
- a central bump-pad array on the die side;
- an inner peripheral interconnect array on the die side;
- an outer peripheral interconnect array on the die side, wherein the outer peripheral interconnect array forms an outer periphery around the inner peripheral interconnect array;
- an outer lower, folded interconnect coupled to the die side, wherein the outer lower folded interconnect is coupled to an outer peripheral interconnect of the outer peripheral interconnect array;
- an inner upper, folded interconnect coupled to the die side, wherein the inner upper folded interconnect is coupled to an inner peripheral interconnect of the inner interconnect array;
- wherein each of the respective inner upper and outer lower interconnects is in a frame, and wherein each of the respective inner lower and outer upper interconnect includes a terminal end that extends below the land side;
- and wherein the central bump-pad array is in an infield surrounded by the frame, further including:
- an integrated-circuit die on the die side, wherein the integrated-circuit die is coupled to each of the inner upper and the lower outer folded interconnects, and wherein the integrated-circuit die is coupled to the land side through the integrated-circuit package substrate;
- and wherein inner upper folded interconnect array and the outer lower folded interconnect array are coupled to a chipset on a board, including a voltage regulator on the board.
A method of assembling an integrated-circuit package, comprising:
- seating a molded lead frame with a folded interconnect, onto a die side of an integrated circuit package substrate;
- coupling the folded interconnect to a board onto which the integrated-circuit package substrate is mounted;
- and forming an electrical connection between the integrated-circuit package substrate on a land side, to the board, wherein the folded interconnect is folded within the molded lead frame, and wherein the folded interconnect has a foot where the folded interconnect contacts the board, further including:
- contacting the foot and the board with an electrical bump;
- reflowing electrical bumps between the land side and the board;
- and seating an integrated-circuit die on the die side in an infield formed by the frame.
Dependencies are inferred from the claim text.